Wet cleaning apparatus including a cover for removing impurities thereon
    2.
    发明申请
    Wet cleaning apparatus including a cover for removing impurities thereon 审中-公开
    湿式清洗装置,包括用于除去杂质的盖子

    公开(公告)号:US20050279389A1

    公开(公告)日:2005-12-22

    申请号:US11144220

    申请日:2005-06-02

    CPC classification number: H01L21/67057 B08B3/04 B08B17/06

    Abstract: An apparatus is provided for performing a wet process to a substrate. The apparatus comprises a bath, having a top portion which defines an opening, for storing a liquid for wet processing the substrate. A cover is also provided which is movably connected to the bath at the top portion thereof. The cover includes a first face facing the opening of the bath and a second face facing away from the opening of the bath. The second face has a plurality of holes therewithin. It also contains a portion interposed between the first and second faces in communication with the holes for containing a cleaning solution. The cleaning solution is discharged through the holes from the containing portion and flows on the second face for removing any impurities from the second face.

    Abstract translation: 提供了一种用于对基底进行湿法处理的装置。 该装置包括一个浴,其具有限定开口的顶部,用于储存用于湿处理基底的液体。 还提供了一个盖子,其顶部可移动地连接到浴缸。 所述盖包括面向所述槽的开口的第一面和背离所述浴的开口的第二面。 第二面在其中具有多个孔。 它还包含插入在与用于容纳清洁溶液的孔连通的第一和第二面之间的部分。 清洗液通过孔从容纳部排出,在第二面上流动,从第二面除去杂质。

    WAFER GUIDE FOR PREVENTING WAFER BREAKAGE IN SEMICONDUCTOR CLEANING APPARATUS
    4.
    发明申请
    WAFER GUIDE FOR PREVENTING WAFER BREAKAGE IN SEMICONDUCTOR CLEANING APPARATUS 失效
    用于防止半导体清洁装置中的破损的波形指南

    公开(公告)号:US20090067960A1

    公开(公告)日:2009-03-12

    申请号:US12209897

    申请日:2008-09-12

    CPC classification number: H01L21/67757 H01L21/67313

    Abstract: A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.

    Abstract translation: 用于防止半导体清洁装置中的晶片断裂的晶片引导件包括下支撑件,侧支撑件,固定单元和止动件。 下部支撑件设置有在长度方向上以相同的间隔形成的多个狭槽,以在其上垂直放置多个晶片。 侧支持者在下支持者上方的每一侧被平行地构造和排列。 侧支撑件支撑晶片的侧端部分。 固定单元适于支撑下支架的两个端部和侧支撑件,并且可以固定到一个槽。 止动件分别联接到每个固定单元。 当机械手卡盘脱离正常对准范围时,止动件可操作以在机器人卡盘的保持单元的闭合操作中产生错误,从而不执行晶片夹紧,从而防止晶片夹紧期间晶片断裂。

    Wafer guide for preventing wafer breakage in semiconductor cleaning apparatus
    6.
    发明授权
    Wafer guide for preventing wafer breakage in semiconductor cleaning apparatus 失效
    用于防止半导体清洁装置中的晶片破裂的晶片引导件

    公开(公告)号:US08033401B2

    公开(公告)日:2011-10-11

    申请号:US12209897

    申请日:2008-09-12

    CPC classification number: H01L21/67757 H01L21/67313

    Abstract: A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.

    Abstract translation: 用于防止半导体清洁装置中的晶片断裂的晶片引导件包括下支撑件,侧支撑件,固定单元和止动件。 下部支撑件设置有在长度方向上以相同的间隔形成的多个狭槽,以在其上垂直放置多个晶片。 侧支持者在下支持者上方的每一侧被平行地构造和排列。 侧支撑件支撑晶片的侧端部分。 固定单元适于支撑下支架的两个端部和侧支撑件,并且可以固定到一个槽。 止动件分别联接到每个固定单元。 当机械手卡盘脱离正常对准范围时,止动件可操作以在机器人卡盘的保持单元的闭合操作中产生错误,从而不执行晶片夹紧,从而防止晶片夹紧期间晶片断裂。

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