Abstract:
In a method of processing a semiconductor structure and a method of forming a capacitor for a semiconductor device using the same, a semiconductor structure may be cleaned using a cleaning solution having a surface tension lower than that of water. The semiconductor structure may be dried in an isopropyl alcohol vapor atmosphere.
Abstract:
An apparatus is provided for performing a wet process to a substrate. The apparatus comprises a bath, having a top portion which defines an opening, for storing a liquid for wet processing the substrate. A cover is also provided which is movably connected to the bath at the top portion thereof. The cover includes a first face facing the opening of the bath and a second face facing away from the opening of the bath. The second face has a plurality of holes therewithin. It also contains a portion interposed between the first and second faces in communication with the holes for containing a cleaning solution. The cleaning solution is discharged through the holes from the containing portion and flows on the second face for removing any impurities from the second face.
Abstract:
A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.
Abstract:
A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.
Abstract:
A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.
Abstract:
A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.