Flexible copper-coated laminate and flexible printed circuit board
    1.
    发明授权
    Flexible copper-coated laminate and flexible printed circuit board 失效
    柔性铜涂层压板和柔性印刷电路板

    公开(公告)号:US5637382A

    公开(公告)日:1997-06-10

    申请号:US592480

    申请日:1996-01-26

    摘要: The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.

    摘要翻译: 本发明的目的是体现双层柔性印刷电路板(FPC)的进一步减薄,并提供一种柔性的铜涂层压板,其能够制造出具有弯曲特性和耐热性能的区别的新型柔性印刷电路板,并提供 使用新型柔性铜包覆层压板的印刷电路板。 为了实现上述目的,根据本发明的新型柔性铜包覆层压板10和12分别通过在单个表面或两个表面上直接形成厚度为10μm或小于10μm的铜层16 由聚酰亚胺聚合物构成的聚酰亚胺膜14,该聚酰亚胺聚合物的初始拉伸弹性模量为400kg / mm2以上400kg / mm2以下,厚度为10μm以下,10μm以下。

    Polyimide resin film and method of making said film
    2.
    发明授权
    Polyimide resin film and method of making said film 失效
    聚酰亚胺树脂膜及其制造方法

    公开(公告)号:US5300619A

    公开(公告)日:1994-04-05

    申请号:US820864

    申请日:1992-03-18

    摘要: A resin film useful mainly for fabricating flexible printed circuits, and a method of producing same. In the process of fabricating a flexible printed circuit board, a copper foil(2) is thermally bonded to a resin film(1), and the copper foil(2) is then etched to a predetermined pattern, in which case the board is generally subject to some dimensional change. In order to minimize such dimensional change it is arranged that the ratio(a/b) of the linear expansion coefficient(a) of the resin film(1) in the direction of mechanical feed(MD direction) to the linear expansion coefficient(b) of the resin film(1) in a direction perpendicular to the MD direction (TD direction) is more than 0.2 but less than 1.0 and that the linear expansion coefficient in MD direction is 0.4-2.0.times. 10.sup.-5 .degree..sup.-1. For such resin film is used a polyimide film containing more than 90% of a recurring unit expressed by a specified general formula. To produce such a resin film, film 1 is drawn by a factor of from 1.0 to 1.5 in MD direction and is also drawn by a factor of from 0.5 to 0.99 in TD direction.

    摘要翻译: PCT No.PCT / JP91 / 00673 Sec。 371日期:1992年3月18日 102(e)1992年3月18日PCT PCT 1991年5月20日PCT公布。 出版物WO91 / 17880 PCT 日本1991年11月28日。一种主要用于制造柔性印刷电路的树脂膜及其制造方法。 在制造柔性印刷电路板的过程中,将铜箔(2)热粘合到树脂膜(1)上,然后将铜箔(2)蚀刻成预定图案,在这种情况下,板通常 受到一些尺寸变化的影响。 为了使这种尺寸变化最小化,将树脂膜(1)的机械供给方向(MD方向)的线膨胀系数(a)与线膨胀系数(b)的比(a / b) )在与MD方向垂直的方向(TD方向)上大于0.2且小于1.0,MD方向的线膨胀系数为0.4-2.0×10-5度-1。 对于这种树脂膜,使用含有超过90%的由特定通式表示的重复单元的聚酰亚胺膜。 为了制造这样的树脂膜,将膜1在MD方向拉伸1.0〜1.5倍,在TD方向上拉伸0.5〜0.99倍。

    Film distinguished in coriona resistant characteristic and insulated wires, coils and motors comprising the film as an insulation material
    3.
    发明授权
    Film distinguished in coriona resistant characteristic and insulated wires, coils and motors comprising the film as an insulation material 失效
    具有抗Coriona特性的膜和绝缘线,线圈和电动机,其包括作为绝缘材料的膜

    公开(公告)号:US06194665B1

    公开(公告)日:2001-02-27

    申请号:US08736660

    申请日:1996-10-25

    IPC分类号: H01B734

    摘要: A plastic film distinguished in corona resistant characteristic having a low cost without a low mechanical strength, which plastic film is particularly suitable for making insulated wires, coils, and electric motors capable of fully responding to demands for providing electric trains with higher running speeds and higher acceleration and deceleration. In accordance with one embodiment, the film includes a base layer and at least one thermally conductive layer having a minimum thermal conductivity of 2 W/m·K, preferably 6 W/m·K, more preferably 15 W/m·K laminated horizontally on at least one surface of the base layer. In accordance with another embodiment, the film has a minimum volume electrical resistivity of 1014 &OHgr;·cm, preferably 1015 &OHgr;·cm, and includes a base layer and at least one low-electrical-resistance layer having a maximum superficial electrical resistance of 1013 &OHgr;·cm, preferably 1012 &OHgr;·CM. The thermally conductive layer is preferably formed from at least one inorganic compound or inorganic material selected from the group consisting of metal nitrides, metal carbides, metal silicides, and metal oxides.

    摘要翻译: 一种塑料薄膜,其特征在于具有低成本且低机械强度的耐电晕特性,该塑料薄膜特别适用于制造绝缘线,线圈和电动机,能够完全响应提供具有更高运行速度和更高速度的电动火车的需求 加减速。 根据一个实施例,膜包括基底层和至少一个导热层,其至少一个导热层的热导率最小为2W / mK,优选为6W / mK,更优选为15W / mK, 基层。 根据另一个实施方案,该膜的最小体积电阻率为1014欧标米,优选为1015欧姆·厘米,并且包括基底层和至少一个具有最大表面电阻为1013欧米茄的低电阻层 厘米,优选1012欧米茄。 导热层优选由至少一种选自金属氮化物,金属碳化物,金属硅化物和金属氧化物的无机化合物或无机材料形成。

    Reformed polyimide fluorocarbon resin laminated film
    5.
    发明授权
    Reformed polyimide fluorocarbon resin laminated film 失效
    改性聚酰亚胺氟碳树脂层压膜

    公开(公告)号:US6106949A

    公开(公告)日:2000-08-22

    申请号:US759682

    申请日:1996-12-06

    IPC分类号: B32B27/08

    CPC分类号: B32B27/08

    摘要: The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals.The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

    摘要翻译: 本发明提供了与金属具有优异粘合性的改性聚酰亚胺氟碳树脂层压膜。 根据本发明的改性聚酰亚胺氟碳树脂层压膜是通过将聚碳酸酯树脂层压在聚酰亚胺膜的单面或两面的聚酰亚胺氟碳树脂层合膜的碳氟树脂的表面涂覆有偶联剂而构成的, 或用电晕处理执行。