公开(公告)号：US07061100B2

公开(公告)日：2006-06-13

申请号：US10405524

申请日：2003-04-02

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyosi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyosi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/66 ,  H01L21/481 ,  H01L21/56 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/20752

摘要： A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.

摘要翻译： 半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。 在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。 利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

公开(公告)号：US06885788B2

公开(公告)日：2005-04-26

申请号：US10609494

申请日：2003-06-20

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC分类号： H05K3/46 ,  G02B6/43 ,  H05K1/02 ,  H05K1/18 ,  G02B6/10 ,  G02B6/12 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K1/185

摘要： A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.

摘要翻译： 其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。 利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。