公开(公告)号：US06885788B2

公开(公告)日：2005-04-26

申请号：US10609494

申请日：2003-06-20

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC分类号： H05K3/46 ,  G02B6/43 ,  H05K1/02 ,  H05K1/18 ,  G02B6/10 ,  G02B6/12 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K1/185

摘要： A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.

摘要翻译： 其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。 利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。

公开(公告)号：US07061100B2

公开(公告)日：2006-06-13

申请号：US10405524

申请日：2003-04-02

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyosi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyosi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/66 ,  H01L21/481 ,  H01L21/56 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/20752

摘要： A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.

摘要翻译： 半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。 在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。 利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

公开(公告)号：US20050006142A1

公开(公告)日：2005-01-13

申请号：US10888140

申请日：2004-07-09

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US20070069393A1

公开(公告)日：2007-03-29

申请号：US10565378

申请日：2004-07-22

申请人： Toshiyuki Asahi ,  Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Seiichi Nakatani ,  Yasuhiro Sugaya

发明人： Toshiyuki Asahi ,  Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Seiichi Nakatani ,  Yasuhiro Sugaya

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2924/1017 ,  H05K1/185 ,  H05K1/187

摘要： A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

摘要翻译： 通过将球状半导体元件嵌入构成布线板的电绝缘基板中，可以获得具有高密度布线的双面或多层布线板，并且可以使用这种布线板设置薄的电子设备。 此外，可以通过嵌入球形半导体元件来提供能够容纳在有限空间中同时保持所需形式的柔性双面或多层布线板，并且可以使用各种这样的布线来提供薄的电子设备 通过根据需要向这种布线板的期望部件赋予不同类型的柔性。

公开(公告)号：US07341890B2

公开(公告)日：2008-03-11

申请号：US11478415

申请日：2006-06-28

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/02 ,  H01L23/12

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US07136543B2

公开(公告)日：2006-11-14

申请号：US10879067

申请日：2004-06-30

申请人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

发明人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

IPC分类号： G02B6/12 ,  H01L3/00

CPC分类号： H01L31/035281 ,  G02B6/43 ,  H01L33/20 ,  H01L33/24 ,  H01L2224/16225 ,  H01L2924/1017 ,  Y02E10/50

摘要： A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).

摘要翻译： 一种安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。 通过电连接部分（100a）连接光电转换装置（10a），球形半导体装置（12a）和（12b）和电转换装置（10b） 14），使得由光电转换装置（10a）接收的光被球形半导体器件（12a）和（12b）放大，然后从电光转换装置（10b）发射。

公开(公告)号：US20050002608A1

公开(公告)日：2005-01-06

申请号：US10879067

申请日：2004-06-30

申请人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

发明人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

IPC分类号： G02B6/12 ,  G02B6/02 ,  G02B6/43 ,  H01L23/52 ,  H01L27/00 ,  H01L31/0352 ,  H01L33/20 ,  H01L33/24 ,  G02B6/26

CPC分类号： H01L31/035281 ,  G02B6/43 ,  H01L33/20 ,  H01L33/24 ,  H01L2224/16225 ,  H01L2924/1017 ,  Y02E10/50

摘要： A mount assembly with an excellent handling property which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly is provided. The mount assembly 100 is obtained by connecting a photo-electro conversion device 10a, spherical semiconductor devices 12a and 12b and an electro-photo conversion device 10b through electrical-connection portions 14 so that a light received by the photo-electro conversion device 10a is amplified by the spherical semiconductor devices 12a and 12b and then emitted from the electro-photo conversion device 10b.

摘要翻译： 具有良好处理性能的安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且在光传输线与安装组件之间的连接部分不需要高度精确的垂直度， 提供。 通过电连接部14将光电转换装置10a，球形半导体装置12a，12b与电光转换装置10b连接，由光电转换装置10a接收的光为 由球形半导体器件12a和12b放大，然后从电光转换器件10b发射。

公开(公告)号：US20060244119A1

公开(公告)日：2006-11-02

申请号：US11478415

申请日：2006-06-28

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/02

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子电连接到第二布线图案。

公开(公告)号：US07091593B2

公开(公告)日：2006-08-15

申请号：US10888140

申请日：2004-07-09

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/12 ,  H01L23/02

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US20070137890A1

公开(公告)日：2007-06-21

申请号：US11698876

申请日：2007-01-29

申请人： Hiroyoshi Tagi ,  Tetsuyoshi Ogura ,  Yutaka Taguchi ,  Toshiyuki Asahi ,  Tatsuo Ogawa

发明人： Hiroyoshi Tagi ,  Tetsuyoshi Ogura ,  Yutaka Taguchi ,  Toshiyuki Asahi ,  Tatsuo Ogawa

IPC分类号： H05K1/16

CPC分类号： H05K1/0233 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614

摘要： A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.

摘要翻译： 信号传输引线105设置在电绝缘层103上。 提供辅助引线104A和104B，而辅助引线104A和104B不与信号传输引线105电接触。 辅助引线104A和104B的至少一部分被电磁屏蔽层106覆盖。 因此，可以抑制来自印刷电路板的内部或外部的辐射噪声，而不会降低通过信号传输引线105传输的信号的特性。