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公开(公告)号：US20100190899A1
公开(公告)日：2010-07-29
申请号：US11916105
申请日：2006-05-17
申请人： Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
发明人： Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
IPC分类号： C08K5/5399 , C08L63/00 , C08L77/00 , C08K3/36
CPC分类号： C08L63/00 , C08K5/5399 , C08L77/10 , H05K1/0326 , C08L2666/20
摘要： The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.
摘要翻译： 本发明的环氧树脂组合物的特征在于，使用具有与氨基相邻的具有酚羟基的羟基取代芳香族胺部分的聚酰胺化合物作为环氧树脂固化剂。
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公开(公告)号：US20090030147A1
公开(公告)日：2009-01-29
申请号：US12278176
申请日：2007-02-08
IPC分类号： C08L71/12
CPC分类号： C08J5/24 , C08G59/46 , C08J2377/00 , C08K3/013 , C08L63/00 , C08L77/00 , H05K1/0326 , H05K1/0373 , Y10S428/901 , Y10T428/24994 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31725 , C08L2666/22
摘要： An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E):(A): a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B): an epoxy resin; (C): an epoxy resin curing agent; (D): a filler; and (E): a solvent.
摘要翻译： 用于预浸料的环氧树脂固化性组合物，其包含以下成分（A）〜（E）：（A）：具有由具有酚性羟基的芳香族二胺构成的聚酰胺化合物，具有酚性羟基的芳香族二胺 在与氨基相邻的位置; （B）：环氧树脂; （C）：环氧树脂固化剂; （D）：填料; 和（E）：溶剂。
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公开(公告)号：US08153260B2
公开(公告)日：2012-04-10
申请号：US12595307
申请日：2008-05-29
CPC分类号： H05K1/036 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/0269 , B32B2262/0276 , B32B2262/062 , B32B2262/10 , B32B2262/101 , B32B2262/106 , B32B2264/105 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , C08G59/44 , H05K1/0346 , H05K2201/0154 , Y10T428/263 , Y10T428/266 , Y10T428/269 , Y10T428/31511 , Y10T428/31721 , Y10T428/31725
摘要： A composite material obtained by laminating (A) a layer formed from an epoxy resin curing composition and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. The epoxy resin curing composition includes a curing agent containing a polyamide compound having a repeat unit comprising a phenolic hydroxyl group containing structure represented by the following formula (I) or (II): In formula (I), ring A and R each represent a phenylene group or a naphthylene group, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediarylene group having 13 to 25 carbon atoms, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms.
摘要翻译： 通过层压（A）由环氧树脂固化组合物形成的层和（B）彼此的聚酰亚胺层而获得的复合材料。 复合材料优选通过将环氧树脂固化组合物施加到聚酰亚胺膜或片材的至少一侧来获得。 环氧树脂固化组合物包括含有具有由下式（I）或（II）表示的含酚羟基的结构的重复单元的聚酰胺化合物的固化剂：式（I）中，环A和R各自表示 亚苯基或亚萘基，其各自可以被卤素原子，羟基或具有1至4个碳原子的烷基取代。 式（II）中，环B为碳原子数6〜18的亚芳基或碳原子数13〜25的亚烷基亚芳基，各自可以被卤素原子，羟基或具有1〜 4个碳原子。
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公开(公告)号：US07294660B2
公开(公告)日：2007-11-13
申请号：US10518008
申请日：2003-06-06
摘要： An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property due to the direction of application.
摘要翻译： 环氧树脂组合物，其包含100重量份的环氧树脂和1至800重量份的平均纤维直径为0.25μm或更小的硼酸铝晶须。 环氧树脂组合物含有大量的均匀分散的硼酸铝晶须，机械强度优异，并且由于施加方向而导致的机械性能的各向异性被抑制。
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公开(公告)号：US20100112323A1
公开(公告)日：2010-05-06
申请号：US12595307
申请日：2008-05-29
IPC分类号： B32B27/38
CPC分类号： H05K1/036 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/0269 , B32B2262/0276 , B32B2262/062 , B32B2262/10 , B32B2262/101 , B32B2262/106 , B32B2264/105 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , C08G59/44 , H05K1/0346 , H05K2201/0154 , Y10T428/263 , Y10T428/266 , Y10T428/269 , Y10T428/31511 , Y10T428/31721 , Y10T428/31725
摘要： A composite material obtained by laminating (A) a layer formed of an epoxy resin curing composition including a polyamide compound having a structure containing a phenolic hydroxyl group represented by the following formula (I) or (II) in its repeating unit and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. In formula (I), ring A and R each represent an arylene group having 6 to 18 carbon atoms, an alkylidenediarylene group having 13 to 25 carbon atoms, etc. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediaryl group having 13 to 25 carbon atoms.
摘要翻译： （A）由包含具有下述式（I）或（II）表示的酚羟基的结构的聚酰胺化合物的环氧树脂固化性组合物的层叠体（A）和（B） 一层聚酰亚胺彼此。 复合材料优选通过将环氧树脂固化组合物施加到聚酰亚胺膜或片材的至少一侧来获得。 在式（I）中，环A和R各自表示碳原子数为6〜18的亚芳基，碳原子数为13〜25的亚烷基亚芳基等。式（II）中，环B为6〜18的亚芳基 碳原子或碳原子数为13〜25的亚烷基二芳基。
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公开(公告)号：US08426504B2
公开(公告)日：2013-04-23
申请号：US11916105
申请日：2006-05-17
申请人： Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
发明人： Takahiro Mori , Setsuko Hirakawa , Yoshihiro Fukuda , Seiichi Saito , Yoshinori Takahata , Mitsunori Ide
IPC分类号： C08K5/49
CPC分类号： C08L63/00 , C08K5/5399 , C08L77/10 , H05K1/0326 , C08L2666/20
摘要： The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.
摘要翻译： 本发明的环氧树脂组合物的特征在于，使用具有与氨基相邻的具有酚羟基的羟基取代芳香族胺部分的聚酰胺化合物作为环氧树脂固化剂。
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公开(公告)号：US07906213B2
公开(公告)日：2011-03-15
申请号：US12278176
申请日：2007-02-08
IPC分类号： B32B15/092 , B32B15/088 , B32B27/04 , B32B27/34 , B32B27/38 , C08L63/00
CPC分类号： C08J5/24 , C08G59/46 , C08J2377/00 , C08K3/013 , C08L63/00 , C08L77/00 , H05K1/0326 , H05K1/0373 , Y10S428/901 , Y10T428/24994 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31725 , C08L2666/22
摘要： An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A) a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin curing agent; (D) a filler; and (E) a solvent.
摘要翻译： 一种预浸料用环氧树脂固化性组合物，其包含以下成分（A）〜（E）：（A）具有由酚羟基构成的芳香族二胺的结构的聚酰胺化合物，具有酚羟基的芳香族二胺 与氨基相邻的位置; （B）环氧树脂; （C）环氧树脂固化剂; （D）填料; 和（E）溶剂。
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公开(公告)号：US20060173101A1
公开(公告)日：2006-08-03
申请号：US10548178
申请日：2004-03-05
IPC分类号： C08L63/00
CPC分类号： C08G59/4014 , C08K7/00 , C08L63/00
摘要： An epoxy resin composition is disclosed which contains (A) 1-10 weight % of a polyvalent epoxy compound, (B) 1-10 weight % of a curing agent selected among cyanate compounds and benzoxazine compounds, (C) 0.1-5 weight % of a polyvalent phenolic compound and (D) 80-97.9 weight % of a spherical filler having an elastic modulus of 300 GPa or more. The epoxy resin composition has a void fraction of 3% or less and a high elastic modulus.
摘要翻译： 公开了一种环氧树脂组合物，其含有（A）1-10重量％的多价环氧化合物，（B）1-10重量％的选自氰酸酯化合物和苯并恶嗪化合物的固化剂，（C）0.1-5重量％ 的多价酚类化合物和（D）80-97.9重量％的弹性模量为300GPa以上的球形填料。 环氧树脂组合物的空隙率为3％以下，弹性模量高。
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公开(公告)号：US20050176854A1
公开(公告)日：2005-08-11
申请号：US10518008
申请日：2003-06-06
摘要： An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 μm or less. The epoxy resin composition contains a large amount of the aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property due to the direction of application.
摘要翻译： 环氧树脂组合物，其包含100重量份的环氧树脂和1至800重量份的平均纤维直径为0.25μm或更小的硼酸铝晶须。 环氧树脂组合物含有大量的均匀分散的硼酸铝晶须，机械强度优异，并且由于施加方向而导致的机械性能的各向异性被抑制。
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