公开(公告)号：US06337609B1

公开(公告)日：2002-01-08

申请号：US09381298

申请日：1999-09-22

申请人： Kenji Endou ,  Yoshiyuki Yasukawa ,  Tadao Fujii

发明人： Kenji Endou ,  Yoshiyuki Yasukawa ,  Tadao Fujii

IPC分类号： H01P900

CPC分类号： H01P3/06 ,  H01P9/00

摘要： A delay line component having merits of small physical size and small insertion loss in a radio frequency. The delay line component with coaxial cable structure includes a center conductor, a dielectric which surrounds the center conductor and an outer conductor which is formed outside the dielectric. The dielectric is made of a ceramic dielectric with a large dielectric constant.

摘要翻译： 具有物理尺寸小，射频插入损耗小的延迟线分量。 具有同轴电缆结构的延迟线部​​件包括中心导体，围绕中心导体的电介质和形成在电介质外部的外部导体。 电介质由具有大介电常数的陶瓷电介质制成。

公开(公告)号：US06420476B1

公开(公告)日：2002-07-16

申请号：US09292842

申请日：1999-04-16

申请人： Toshiaki Yamada ,  Hiroaki Hasegawa ,  Yoshiyuki Yasukawa ,  Kenji Endou ,  Michihisa Yamada ,  Yasuo Moriya ,  Tomiho Yamada ,  Tetsuya Itoh

发明人： Toshiaki Yamada ,  Hiroaki Hasegawa ,  Yoshiyuki Yasukawa ,  Kenji Endou ,  Michihisa Yamada ,  Yasuo Moriya ,  Tomiho Yamada ,  Tetsuya Itoh

IPC分类号： C08L900

CPC分类号： H01B3/442 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0373 ,  H05K2201/0209

摘要： The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

摘要翻译： 本发明的目的是提供一种具有从高频带和低介电损耗角正切相对较宽范围内选择的任何所需介电常数的复合电介质材料，以及膜，基片，电子部件或模制或其它形成的制品 使用相同 为了实现该目的，提供了一种复合介电材料组合物，其包括耐热低介电聚合物材料，其是包含一种或两种或更多种重均分子量绝对分子量至少为1,000的树脂组合物，其中 所述组合物中碳原子和氢原子的总和为至少99％，并且部分或全部树脂分子之间具有化学键和填料。 使用该组合物获得薄膜，基材，电子部件或模制或其它成型制品。

公开(公告)号：US06500535B1

公开(公告)日：2002-12-31

申请号：US09140533

申请日：1998-08-26

申请人： Toshiaki Yamada ,  Takeshi Takahashi ,  Yoshiyuki Yasukawa ,  Kenji Endou ,  Shigeru Asami ,  Michihisa Yamada ,  Yasuo Moriya

发明人： Toshiaki Yamada ,  Takeshi Takahashi ,  Yoshiyuki Yasukawa ,  Kenji Endou ,  Shigeru Asami ,  Michihisa Yamada ,  Yasuo Moriya

IPC分类号： B32B2732

CPC分类号： C08J5/18 ,  B32B27/00 ,  C08F255/00 ,  C08L23/08 ,  C08L23/0838 ,  C08L51/06 ,  C08L53/00 ,  C08L2203/202 ,  H01B3/442 ,  H05K1/032 ,  Y10T428/254 ,  Y10T428/31913 ,  Y10T428/31917 ,  Y10T428/31924 ,  C08L2666/04

摘要： The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

摘要翻译： 本发明提供一种耐热低介电聚合物材料，其优选是其中非极性α-烯烃基聚合物链段和乙烯基芳族共聚物链段彼此化学结合的共聚物，并且是热塑性树脂，其表现出 其中由一段形成的分散相被细分散在由另一段形成的连续相中的多相结构。 因此，可以实现耐热性优异，强度高，介电常数低，介电损耗降低的聚合材料，因此适用于高频用电绝缘材料。