公开(公告)号：US5111363A

公开(公告)日：1992-05-05

申请号：US365116

申请日：1989-06-12

申请人： Nobuyuki Yagi ,  Jiroh Inagaki ,  Kozo Morita ,  Yosutoshi Kaku ,  Shinji Mizuno ,  Akiko Yamanaka

发明人： Nobuyuki Yagi ,  Jiroh Inagaki ,  Kozo Morita ,  Yosutoshi Kaku ,  Shinji Mizuno ,  Akiko Yamanaka

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28

CPC分类号： H05K3/284 ,  H05K1/189 ,  H05K1/09 ,  H05K1/118 ,  H05K2201/0129 ,  H05K2201/10689 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K3/0058 ,  H05K3/281

摘要： A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.