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6 条记录 (耗时 0.012 秒)

    Apparatus for testing a semiconductor package
    1.
    发明授权
    Apparatus for testing a semiconductor package 失效
    用于测试半导体封装的装置

    公开(公告)号：US07816937B2

    公开(公告)日：2010-10-19

    申请号：US12167000

    申请日：2008-07-02

    申请人： Young-Ki Kwak ,  Chul-Woong Jang ,  Woon-Sup Choi ,  Jong-pil Park

    发明人： Young-Ki Kwak ,  Chul-Woong Jang ,  Woon-Sup Choi ,  Jong-pil Park

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2893

    摘要： An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.

    摘要翻译： 用于测试物体的装置包括测试室，引导构件，测试单元和传送单元。 测试室配置成接收物体。 引导构件沿着测试室中的第一方向布置。 测试单元可移动地连接到引导构件以测试物体的电特性。 转移单元布置在测试室中以将物体装载到一个测试单元中，并从其中一个测试单元卸载物体。 测试单元可以被转移到用于修理的位置，而不会悬挂设备。 该对象可以使用另一个测试单元进行测试，而另一个测试单元正在修复。

    Apparatus and method for performing parallel test on integrated circuit devices
    2.
    发明授权
    Apparatus and method for performing parallel test on integrated circuit devices 有权
    在集成电路设备上执行并行测试的装置和方法

    公开(公告)号：US07227351B2

    公开(公告)日：2007-06-05

    申请号：US10856461

    申请日：2004-05-27

    申请人： Woo-Il Kim ,  Hyun-Seop Shim ,  Hyoung-Young Lee ,  Young-Ki Kwak ,  Jeong-Ho Bang ,  Ki-Bong Ju

    发明人： Woo-Il Kim ,  Hyun-Seop Shim ,  Hyoung-Young Lee ,  Young-Ki Kwak ,  Jeong-Ho Bang ,  Ki-Bong Ju

    IPC分类号： G01R31/28

    CPC分类号： G01R31/31905 ,  G11C2029/2602

    摘要： Embodiments of the invention connect a plurality of devices under test (DUTS) in a parallel manner and a high test current is selectively applied to each DUT. The apparatus to test a plurality of DUTs includes a plurality of power sources providing the test current to a plurality of DUTs; and switching devices connected to the respective DUTs and power sources and selectively providing the test current. In addition, the apparatus has at least one control unit to control the switching devices. Furthermore, a group of DUTs from the plurality of DUTs is connected between two of the plurality of power sources in a parallel manner, and the test current is selectively provided to one DUT from the group of DUTs according to the operation of the switching devices.

    摘要翻译： 本发明的实施例以并行方式连接多个待测器件（DUTS），并且将高测试电流选择性地施加到每个DUT。 测试多个DUT的装置包括向多个DUT提供测试电流的多个电源; 以及连接到各个DUT和电源的开关装置，并选择性地提供测试电流。 此外，该装置具有至少一个控制单元来控制开关装置。 此外，来自多个DUT的一组DUT以并行方式连接在多个电源中的两个之间，并且根据开关装置的操作，从DUT组中选择性地向一个DUT提供测试电流。

    APPARATUS FOR TESTING AN OBJECT
    3.
    发明申请
    APPARATUS FOR TESTING AN OBJECT 失效
    用于测试物体的装置

    公开(公告)号：US20090015287A1

    公开(公告)日：2009-01-15

    申请号：US12167000

    申请日：2008-07-02

    申请人： YOUNG-KI KWAK ,  Chul-Woong Jang ,  Woon-Sup Choi ,  Jong-pil Park

    发明人： YOUNG-KI KWAK ,  Chul-Woong Jang ,  Woon-Sup Choi ,  Jong-pil Park

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2893

    摘要： An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.

    摘要翻译： 用于测试物体的装置包括测试室，引导构件，测试单元和传送单元。 测试室配置成接收物体。 引导构件沿着测试室中的第一方向布置。 测试单元可移动地连接到引导构件以测试物体的电特性。 转移单元布置在测试室中以将物体装载到一个测试单元中，并从其中一个测试单元卸载物体。 测试单元可以被转移到用于修理的位置，而不会悬挂设备。 该对象可以使用另一个测试单元进行测试，而另一个测试单元正在修复。

    Apparatus and method for performing parallel test on integrated circuit devices
    5.
    发明申请
    Apparatus and method for performing parallel test on integrated circuit devices 有权
    在集成电路设备上执行并行测试的装置和方法

    公开(公告)号：US20050007140A1

    公开(公告)日：2005-01-13

    申请号：US10856461

    申请日：2004-05-27

    申请人： Woo-Il Kim ,  Hyun-Seop Shim ,  Hyoung-Young Lee ,  Young-Ki Kwak ,  Jeong-Ho Bang ,  Ki-Bong Ju

    发明人： Woo-Il Kim ,  Hyun-Seop Shim ,  Hyoung-Young Lee ,  Young-Ki Kwak ,  Jeong-Ho Bang ,  Ki-Bong Ju

    IPC分类号： G01R31/28 ,  G01R31/319 ,  G11C29/00 ,  G01R31/26

    CPC分类号： G01R31/31905 ,  G11C2029/2602

    摘要： Embodiments of the invention connect a plurality of devices under test (DUTS) in a parallel manner and a high test current is selectively applied to each DUT. The apparatus to test a plurality of DUTs includes a plurality of power sources providing the test current to a plurality of DUTs; and switching devices connected to the respective DUTs and power sources and selectively providing the test current. In addition, the apparatus has at least one control unit to control the switching devices. Furthermore, a group of DUTs from the plurality of DUTs is connected between two of the plurality of power sources in a parallel manner, and the test current is selectively provided to one DUT from the group of DUTs according to the operation of the switching devices.

    摘要翻译： 本发明的实施例以并行方式连接多个待测器件（DUTS），并且将高测试电流选择性地施加到每个DUT。 测试多个DUT的装置包括向多个DUT提供测试电流的多个电源; 以及连接到各个DUT和电源的开关装置，并选择性地提供测试电流。 此外，该装置具有至少一个控制单元来控制开关装置。 此外，来自多个DUT的一组DUT以并行方式连接在多个电源中的两个之间，并且根据开关装置的操作，从DUT组中选择性地向一个DUT提供测试电流。