摘要:
Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.
摘要:
A buffer storage controller includes a read-out buffer address array, a write-in buffer address array and a buffer storage. An operand storage compare (OSC) detecting section compares a column signal and a row signal outputted from the read-out buffer address array to the buffer storage with those outputted by the write-in buffer address array to obtain an OSC detection signal.
摘要:
An electronic telephone terminal having a transmitter and a receiver, both having an approximately linear acoustic-to-electric transduction characteristics, and having a surrounding noise suppression function, and including a variable attenuator for controlling a gain of a transmission system; a noise detection device for detecting surrounding noise; and a control device for controlling the variable attenuator in such a manner that when a sound pressure level input to the transmitter exceeds a predetermined threshold value, the gain is fixedly set to a constant value, and when the input sound pressure level is equal to or below the predetermined threshold level, the gain is controlled in response to a change in the surrounding noise level detected by the noise detection device.