公开(公告)号：US20150007958A1

公开(公告)日：2015-01-08

申请号：US14352507

申请日：2012-10-18

申请人： Yuka Sato ,  SENJU METAL INDUSTRY CO., LTD.

发明人： Issaku Sato ,  Akira Takaguchi ,  Isamu Sato ,  Takashi Nauchi

IPC分类号： B23K1/20 ,  B23K3/08 ,  B22D17/20 ,  B23K3/06

CPC分类号： B23K1/20 ,  B22D17/2023 ,  B23K3/0623 ,  B23K3/0638 ,  B23K3/085 ,  H01L24/11 ,  H01L24/741 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11848 ,  H01L2224/742 ,  H05K3/3468 ,  H01L2924/00012

摘要： Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.

摘要翻译： 提供了一种焊料凸块形成方法，其能够形成微焊料凸块，而不会由于过量熔融焊料而发生桥接。 用于供应熔融焊料的注射头11具有与设置在基板8上的开口的掩模接触的喷嘴16.在完成供给操作之后，通过从冷却单元13的热传递强制冷却喷射头11， 其操作已经停止的加热器单元12。 当注射头11向上移动时，冷却的注射头11中的熔融焊料15不会从喷嘴16流出。

公开(公告)号：US09511438B2

公开(公告)日：2016-12-06

申请号：US14352507

申请日：2012-10-18

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Issaku Sato ,  Akira Takaguchi ,  Isamu Sato ,  Takashi Nauchi

IPC分类号： B23K3/06 ,  H01L21/44 ,  B23K1/20 ,  H01L23/00 ,  B22D17/20 ,  B23K3/08 ,  H05K3/34

CPC分类号： B23K1/20 ,  B22D17/2023 ,  B23K3/0623 ,  B23K3/0638 ,  B23K3/085 ,  H01L24/11 ,  H01L24/741 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11848 ,  H01L2224/742 ,  H05K3/3468 ,  H01L2924/00012

摘要： Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.

摘要翻译： 提供了一种焊料凸块形成方法，其能够形成微焊料凸块，而不会由于过量熔融焊料而发生桥接。 用于供应熔融焊料的注射头11具有与设置在基板8上的开口的掩模接触的喷嘴16.在完成供给操作之后，通过从冷却单元13的热传递强制冷却喷射头11， 其操作已经停止的加热器单元12。 当注射头11向上移动时，冷却的注射头11中的熔融焊料15不会从喷嘴16流出。