公开(公告)号：US20140208850A1

公开(公告)日：2014-07-31

申请号：US13753111

申请日：2013-01-29

申请人： Geun-woo Kim ,  Hyun Kim ,  Yun-sik Yoo ,  Sang-jun Kim ,  Jae-yong Park ,  Tae-gyeong Chung

发明人： Geun-woo Kim ,  Hyun Kim ,  Yun-sik Yoo ,  Sang-jun Kim ,  Jae-yong Park ,  Tae-gyeong Chung

IPC分类号： G01N29/14

CPC分类号： G01N29/14 ,  G01N29/4454 ,  G01N2291/0289 ,  H01L21/67288

摘要： A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.

摘要翻译： 一种半导体器件缺陷检测装置，包括：设置在半导体处理设备上的传感器，所述传感器被配置为检测与半导体处理设备接触的半导体器件发射的信号; 以及信号分析器，被配置为基于在预定频率范围内的检测信号来确定半导体器件是否有缺陷。

公开(公告)号：US09881827B2

公开(公告)日：2018-01-30

申请号：US14714225

申请日：2015-05-15

申请人： Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

发明人： Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

IPC分类号： B32B37/08 ,  H01L21/683 ,  B32B37/00 ,  B32B37/16 ,  H01L21/67 ,  B32B38/18 ,  B32B41/00 ,  B32B37/14 ,  G02F1/13 ,  B32B37/18 ,  B32B38/00 ,  B32B38/10

CPC分类号： H01L21/6836 ,  B32B37/0015 ,  B32B37/0053 ,  B32B37/08 ,  B32B37/144 ,  B32B37/16 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/0036 ,  B32B38/10 ,  B32B38/164 ,  B32B38/18 ,  B32B38/1858 ,  B32B41/00 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2309/02 ,  B32B2457/14 ,  B32B2457/20 ,  B65H2301/517 ,  G02F1/1303 ,  H01L21/67109 ,  H01L21/67132 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17

摘要： An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

公开(公告)号：US20150340263A1

公开(公告)日：2015-11-26

申请号：US14714225

申请日：2015-05-15

申请人： GEUNWOO KIM ,  SEUNGHEE LEE ,  Hyun KIM ,  Ohchul KWON ,  SANGHO AN ,  SEONJU OH ,  Yun-Sik YOO

发明人： GEUNWOO KIM ,  SEUNGHEE LEE ,  Hyun KIM ,  Ohchul KWON ,  SANGHO AN ,  SEONJU OH ,  Yun-Sik YOO

IPC分类号： H01L21/683 ,  B32B37/14 ,  B32B38/18 ,  B32B41/00 ,  B32B37/00 ,  B32B37/16

CPC分类号： H01L21/6836 ,  B32B37/0015 ,  B32B37/0053 ,  B32B37/08 ,  B32B37/144 ,  B32B37/16 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/0036 ,  B32B38/10 ,  B32B38/164 ,  B32B38/18 ,  B32B38/1858 ,  B32B41/00 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2309/02 ,  B32B2457/14 ,  B32B2457/20 ,  B65H2301/517 ,  G02F1/1303 ,  H01L21/67109 ,  H01L21/67132 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17

摘要： An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

摘要翻译： 一种实施方式包括：基板处理装置，包括：带供给部件，其构造成供给要附着于基板的带; 磁带收集构件，被配置成收集在所述磁带附着到所述基板之后留下的剩余磁带; 支撑构件，设置在所述带供应构件和所述带收集构件之间，并且构造成在所述带附接到所述基底时支撑所述基底; 以及温度调节构件，其构造成将从所述带供给构件供给的所述带的温度调整到所述支撑构件。