公开(公告)号：US20160120032A1

公开(公告)日：2016-04-28

申请号：US14922406

申请日：2015-10-26

Applicant: SOOJAE PARK ,  GEUNWOO KIM ,  KEUNHO JANG ,  YOUNJO MUN

Inventor： SOOJAE PARK ,  GEUNWOO KIM ,  KEUNHO JANG ,  YOUNJO MUN

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L21/565 ,  H01L21/50 ,  H01L21/561 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads.

Abstract translation: 包装框架包括设置在包装框架的一个表面上的多个单元区域，围绕一个表面上的单元区域的周边区域和设置在周边区域中的一个表面上的起皱结构。 褶皱结构的第一表面从一个表面延伸并且设置在与一个表面不同的水平。 每个单元区域包括多个导电焊盘。

公开(公告)号：US09881827B2

公开(公告)日：2018-01-30

申请号：US14714225

申请日：2015-05-15

Applicant: Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

Inventor： Geunwoo Kim ,  Seunghee Lee ,  Hyun Kim ,  Ohchul Kwon ,  Sangho An ,  Seonju Oh ,  Yun-Sik Yoo

IPC: B32B37/08 ,  H01L21/683 ,  B32B37/00 ,  B32B37/16 ,  H01L21/67 ,  B32B38/18 ,  B32B41/00 ,  B32B37/14 ,  G02F1/13 ,  B32B37/18 ,  B32B38/00 ,  B32B38/10

CPC classification number: H01L21/6836 ,  B32B37/0015 ,  B32B37/0053 ,  B32B37/08 ,  B32B37/144 ,  B32B37/16 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/0036 ,  B32B38/10 ,  B32B38/164 ,  B32B38/18 ,  B32B38/1858 ,  B32B41/00 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2309/02 ,  B32B2457/14 ,  B32B2457/20 ,  B65H2301/517 ,  G02F1/1303 ,  H01L21/67109 ,  H01L21/67132 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17

Abstract: An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

公开(公告)号：US20150340263A1

公开(公告)日：2015-11-26

申请号：US14714225

申请日：2015-05-15

Applicant: GEUNWOO KIM ,  SEUNGHEE LEE ,  Hyun KIM ,  Ohchul KWON ,  SANGHO AN ,  SEONJU OH ,  Yun-Sik YOO

Inventor： GEUNWOO KIM ,  SEUNGHEE LEE ,  Hyun KIM ,  Ohchul KWON ,  SANGHO AN ,  SEONJU OH ,  Yun-Sik YOO

IPC: H01L21/683 ,  B32B37/14 ,  B32B38/18 ,  B32B41/00 ,  B32B37/00 ,  B32B37/16

CPC classification number: H01L21/6836 ,  B32B37/0015 ,  B32B37/0053 ,  B32B37/08 ,  B32B37/144 ,  B32B37/16 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/0036 ,  B32B38/10 ,  B32B38/164 ,  B32B38/18 ,  B32B38/1858 ,  B32B41/00 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2309/02 ,  B32B2457/14 ,  B32B2457/20 ,  B65H2301/517 ,  G02F1/1303 ,  H01L21/67109 ,  H01L21/67132 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T156/17

Abstract: An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

Abstract translation: 一种实施方式包括：基板处理装置，包括：带供给部件，其构造成供给要附着于基板的带; 磁带收集构件，被配置成收集在所述磁带附着到所述基板之后留下的剩余磁带; 支撑构件，设置在所述带供应构件和所述带收集构件之间，并且构造成在所述带附接到所述基底时支撑所述基底; 以及温度调节构件，其构造成将从所述带供给构件供给的所述带的温度调整到所述支撑构件。

公开(公告)号：US10332755B2

公开(公告)日：2019-06-25

申请号：US15093492

申请日：2016-04-07

Applicant: Hyesun Yoon ,  Geunwoo Kim ,  Youngjun Park

Inventor： Hyesun Yoon ,  Geunwoo Kim ,  Youngjun Park

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/46 ,  H01L23/498 ,  H01L23/00

Abstract: A package substrate includes a core portion comprising a first surface and a second surface arranged opposite to each other; first cutting regions provided to penetrate at least a portion of the core portion in a thickness direction; a first upper circuit pattern disposed on the first surface of the core portion; and an insulating layer provided to cover the first surface of the core portion and to fill the first cutting regions. The first cutting regions are spaced apart from each other in a first direction that is substantially parallel to one side of the core portion.

公开(公告)号：US20160300790A1

公开(公告)日：2016-10-13

申请号：US15093492

申请日：2016-04-07

Applicant: Hyesun YOON ,  Geunwoo KIM ,  Youngjun PARK

Inventor： Hyesun YOON ,  Geunwoo KIM ,  Youngjun PARK

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L21/481 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H05K3/0052 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/0909

Abstract: A package substrate includes a core portion comprising a first surface and a second surface arranged opposite to each other; first cutting regions provided to penetrate at least a portion of the core portion in a thickness direction; a first upper circuit pattern disposed on the first surface of the core portion; and an insulating layer provided to cover the first surface of the core portion and to fill the first cutting regions. The first cutting regions are spaced apart from each other in a first direction that is substantially parallel to one side of the core portion.

Abstract translation: 封装基板包括芯部，该芯部包括彼此相对布置的第一表面和第二表面; 设置成在厚度方向上穿透所述芯部的至少一部分的第一切割区域; 设置在所述芯部的所述第一表面上的第一上电路图案; 以及设置成覆盖芯部的第一表面并填充第一切割区域的绝缘层。 第一切割区域在基本上平行于芯部分的一侧的第一方向上彼此间隔开。