公开(公告)号：US12088053B2

公开(公告)日：2024-09-10

申请号：US17719506

申请日：2022-04-13

Applicant: SENSORVIEW CO., LTD. ,  okins electronics Co., Ltd ,  Hyun Duk Kim

Inventor： Byoung Nam Kim ,  Kyoung Il Kang ,  Jin Woo Lee ,  Jin Kook Jun ,  Sung Gyu Park ,  Hyun Duk Kim ,  Jong Wook Ham ,  Sang Woo Han

IPC: H01R9/05 ,  H01R13/17 ,  H01R13/502

CPC classification number: H01R9/05 ,  H01R13/17 ,  H01R13/502

Abstract: Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.

公开(公告)号：US20240006757A1

公开(公告)日：2024-01-04

申请号：US18468955

申请日：2023-09-18

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam KIM ,  Chul-Keun PARK ,  Hong Il YOO

IPC: H01Q1/52 ,  H01Q9/04

CPC classification number: H01Q1/525 ,  H01Q9/0407

Abstract: A short-range communication antenna for multi-link communication includes a plurality of radiators each independently set to transmit and receive different signals and having a predetermined array structure, in which each of the plurality of radiators includes: a patch-shaped radiating element; a first parasitic element formed to surround the radiating element; and a second parasitic element formed to surround the first parasitic element, wherein each of the plurality of radiators is rotated +90 degrees or −90 degrees compared to adjacent radiators.

公开(公告)号：US11316309B2

公开(公告)日：2022-04-26

申请号：US17178428

申请日：2021-02-18

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam Kim ,  Kyoung Il Kang ,  Dong Il Yim ,  Sung Cheol Cho ,  Ji Hun Kang

IPC: H01R24/50 ,  H01R12/70 ,  H01R103/00 ,  H05K1/11 ,  H01R12/55

Abstract: A connector assembly includes a first signal pin formed to be in contact with a signal line of a circuit board; a first insulator surrounding the first signal pin; and a first housing accommodating the first signal pin and the first insulator and having a hole at a rear thereof corresponding to the first signal pin, wherein the first housing includes at least one clamping arm disposed on at least one side of the hole, protruding to a rear of the first housing, and having a lower surface formed to be in contact with an upper surface of the circuit board and the connector assembly further includes a ground plate disposed below the clamping arm and having an upper surface formed to be in contact with a lower surface of the circuit board; a clamping plate movably disposed below the ground plate; and a fastening member.

公开(公告)号：US12224490B2

公开(公告)日：2025-02-11

申请号：US18171725

申请日：2023-02-21

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam Kim ,  Hong Il Yoo ,  Chul-Keun Park ,  Chan-Woo Park ,  Kyung Hwan Kim

IPC: H01Q13/02 ,  H01P5/107 ,  H01Q21/00

Abstract: A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator.

公开(公告)号：US20240322497A1

公开(公告)日：2024-09-26

申请号：US18261686

申请日：2022-01-11

Applicant: Sensorview Co., LTD. ,  Okins Electronics Co., LTD.

Inventor： Byoung Nam Kim ,  Kyoung Il Kang ,  Joung Min Park ,  Sung Cheol Cho ,  Jin Kook Jun ,  Sung Gyu Park ,  Jong Wook Ham

IPC: H01R13/6585 ,  H01R12/75

CPC classification number: H01R13/6585 ,  H01R12/75

Abstract: A connector assembly according to the present invention comprises a receptacle connector and a plug connector vertically coupled to the receptacle connector, the plug connector including: a signal pin having one side in electrical contact with a signal line of a cable and the other side in elastic contact with a clip pin of the receptacle connector; a shield can formed to enclose the signal pin such that the other side of the signal pin is exposed downwards and to be electrically spaced apart from the signal pin; a first insulating member coupled to the signal pin to insulate between the signal pin and the shield can; and a plug shell which has an open lower portion and encloses an upper surface and a side surface of the shield can to expose the other side of the signal pin downwards, the receptacle connector including: a clip pin which has a lower portion in contact with a signal pad of a circuit board and an upper portion in elastic contact with the other side of the signal pin; a receptacle base which is formed to be installed on the circuit board and provides a space in which the clip pin is accommodated; and a second insulating member to which the clip pin is coupled and which encloses the side surfaces of the clip pin to insulate between the clip pin and the receptacle base.

公开(公告)号：US20230282983A1

公开(公告)日：2023-09-07

申请号：US18171725

申请日：2023-02-21

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam KIM ,  Hong Il YOO ,  Chul-Keun PARK ,  Chan-Woo PARK ,  Kyung Hwan KIM

IPC: H01Q13/02 ,  H01Q21/00

CPC classification number: H01Q13/0233 ,  H01Q21/0062

Abstract: A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator.

公开(公告)号：US11424580B2

公开(公告)日：2022-08-23

申请号：US16898604

申请日：2020-06-11

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam Kim ,  Kyoung Il Kang ,  Joung Min Park ,  Sang Woo Han

IPC: H01R13/6593 ,  H01R12/75 ,  H01R13/6582 ,  H01R12/77 ,  H01R13/02 ,  H01R13/502 ,  H01R9/05 ,  H01R12/79 ,  H01R12/71 ,  H01R13/6591 ,  H01R12/59 ,  H01R13/6581 ,  H01R24/50 ,  H01R13/6594 ,  H01R24/00

Abstract: Disclosed is a compact coaxial cable connector for transmitting super-high frequency signals, which is adapted to connect a PCB to a single or multiple super-high frequency coaxial cable signal lines transmitting super-high frequency signals therethrough. The compact coaxial cable connector includes: a single or multiple coaxial cables each including an inner conductor, an outer conductor, a dielectric, and a sheath, wherein the outer conductor, the dielectric, and the sheath are stripped to expose the inner conductor over a predetermined length and a terminal of the exposed inner conductor is brought into electrical contact with a circuit signal line terminal pad formed on the PCB; and a male connector including a shielding can receiving the exposed inner conductors of the single or multiple coaxial cables, securing and protecting ends of the exposed inner conductors, and blocking electromagnetic waves generated from the inner conductors of the single or multiple coaxial cables.

公开(公告)号：US12074360B2

公开(公告)日：2024-08-27

申请号：US18047089

申请日：2022-10-17

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam Kim ,  Hong Il Yoo ,  Chul-Keun Park ,  Chan-Woo Park

IPC: H01Q1/22 ,  G06K19/077 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  G06K19/0775 ,  H01Q1/38

Abstract: An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.

公开(公告)号：US20240204466A1

公开(公告)日：2024-06-20

申请号：US18261790

申请日：2022-01-14

Applicant: Sensorview Co., Ltd. ,  Orkins Electronics Co., LTD.

Inventor： Byoung Nam Kim

IPC: H01R24/44 ,  H01R24/50 ,  H01R103/00

CPC classification number: H01R24/44 ,  H01R24/50 ,  H01R2103/00

Abstract: A plug connector according to the present invention is a plug connector coupled to a receptacle connector, the plug connector comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body, wherein the conductor for signals includes a lower portion protruding below a first portion on the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion, and the conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion, and the lower body includes a lower housing having a hollow portion that is vertically opened, wherein the upper portion of the conductor for ground is accommodated in the hollow portion, and the lower portion of the conductor for ground and the lower portion of the conductor for signals are exposed downwards through the hollow portion, and the upper body includes an upper housing facing the lower housing and having a hollow portion opened downwards so that the hollow portion forms a space around the upper portion of the conductor for signals.

公开(公告)号：US20230294389A1

公开(公告)日：2023-09-21

申请号：US18184831

申请日：2023-03-16

Applicant: SENSORVIEW CO., LTD.

Inventor： Byoung Nam KIM ,  Hong Il YOO ,  Jong Yup LEE ,  Chul-Keun PARK

IPC: B32B37/24 ,  B32B7/12 ,  B32B15/04

CPC classification number: B32B37/24 ,  B32B7/12 ,  B32B15/043 ,  H01Q1/38

Abstract: A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.