公开(公告)号：US20220177749A1

公开(公告)日：2022-06-09

申请号：US17441319

申请日：2020-03-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Elisabeth Cura ,  Boris Tasch ,  Adrian Jung

IPC: C09J163/00 ,  C08G59/68

Abstract: The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.

公开(公告)号：US20220243102A1

公开(公告)日：2022-08-04

申请号：US17607279

申请日：2020-04-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ahmad Shaaban ,  Adrian Jung ,  Manfred Ludsteck ,  Adrian Eckert ,  Li Yao ,  Simon Plugge ,  Lingjie Tong

IPC: C09J133/08 ,  C09J133/10 ,  C08K3/22 ,  C08F220/18 ,  C08F220/06 ,  C08F220/28 ,  C08F222/10 ,  C08F230/02

Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.

公开(公告)号：US20220213364A1

公开(公告)日：2022-07-07

申请号：US17441058

申请日：2020-03-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Boris Tasch ,  Adrian Jung

IPC: C09J179/00

Abstract: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer; and e) a thixotropic agent. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding two parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.