公开(公告)号：US20220153987A1

公开(公告)日：2022-05-19

申请号：US17593250

申请日：2019-12-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lingjie Tong ,  Yuan Zhao ,  Li Yao ,  Shuang Wu ,  Xiaohai Sheng ,  Xinxin Sun ,  Ahmad Shaaban ,  Menghuang Feng

IPC: C08L63/00 ,  C08K3/013 ,  C08G59/68 ,  C08K5/37

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises ether in the backbone thereof.

公开(公告)号：US20200270480A1

公开(公告)日：2020-08-27

申请号：US16629697

申请日：2018-07-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lingjie Tong

IPC: C09J4/00 ,  C08F220/18

Abstract: The present invention provides a one-part thermal-curing acrylate adhesive precursor, calculated by 100 wt. % of said one-part thermal-curing acrylate adhesive precursor, comprising: 20 to 85 wt. % of polyurethane modified acrylate oligomer; 5 to 25 wt. % of methacrylic acid; 5 to 65 wt. % of acrylate monomer; 0.5 to 5 wt. % of adhesion promoter; and 1 to 12 wt. % of initiator. The present invention also provides a preparation method for said one-part thermal-curing acrylate adhesive precursor. According to the technical scheme of the present invention, a one-part acrylate adhesive precursor with excellent adhesive properties, which can be thermal-cured, is provided.

公开(公告)号：US20250043164A1

公开(公告)日：2025-02-06

申请号：US18714726

申请日：2022-12-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lingjie Tong ,  Jiaxing Sun

IPC: C09J163/00 ,  C08G59/24 ,  C08G59/66 ,  C08G59/68 ,  C08K5/54 ,  C08K5/55 ,  C09J11/06

Abstract: The present invention provides a single-component epoxy adhesive composition and a preparation method thereof. The single-component epoxy adhesive composition comprises, based on the total weight thereof as 100 wt %: 42-67 wt % of an epoxy resin without a benzene ring structure; 32-57 wt % of a polymercaptan; and 0.1-12 wt % of an initiator. The single-component epoxy adhesive composition according to a technical solution of the invention has high light transmittance after curing, long time available for construction, good adhesion, and in particular good weather resistance (yellowing resistance), and is suitable for electronic industrial assembly, and especially for the assembly and sealing of electronic display devices.

公开(公告)号：US20240228839A1

公开(公告)日：2024-07-11

申请号：US18002113

申请日：2021-06-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lingjie Tong ,  Xiaohai Sheng ,  Ahmad Shaaban

IPC: C09J133/08 ,  C09J4/06 ,  C09J11/04 ,  C09J11/06

CPC classification number: C09J133/08 ,  C09J4/06 ,  C09J11/04 ,  C09J11/06

Abstract: The present invention provides a two-component thermally conductive adhesive composition and a two-component thermally conductive gap-filling glue. The composition comprises: 8-38 wt % of an acrylate monomer or a combination of an acrylate monomer and an acrylate oligomer, with a glass transition temperature ranging from −80° C. to −10° C.: 0.2-4 wt % of a peroxide oxidant: 0.05-1 wt % of a peroxide decomposition promoter; and 60-90 wt % of a thermally conductive filler, wherein the two-component thermally conductive adhesive composition comprises Part A and Part B. Part A comprises a peroxide oxidant and Part B comprises a peroxide decomposition promoter: the acrylate monomer, or the combination of the acrylate monomer and the acrylate oligomer, and the thermally conductive filler exist in one or both of Part A and Part B. The products of the two-component thermally conductive adhesive composition and the two-component thermally conductive gap-filling glue after curing have a high elongation-at-break, high thermal conductivity and low bonding strength to aluminum metal surfaces, and are suitable for use as a thermally conductive gap-filling material in the battery pack module of an electro-mobile.

公开(公告)号：US20220243102A1

公开(公告)日：2022-08-04

申请号：US17607279

申请日：2020-04-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ahmad Shaaban ,  Adrian Jung ,  Manfred Ludsteck ,  Adrian Eckert ,  Li Yao ,  Simon Plugge ,  Lingjie Tong

IPC: C09J133/08 ,  C09J133/10 ,  C08K3/22 ,  C08F220/18 ,  C08F220/06 ,  C08F220/28 ,  C08F222/10 ,  C08F230/02

Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.

公开(公告)号：US20220162376A1

公开(公告)日：2022-05-26

申请号：US17440976

申请日：2019-03-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Li Yao ,  Michael A. Kropp ,  Matthew J. Kryger ,  Wayne S. Mahoney ,  Mario A. Perez ,  Shuang Wu ,  Lingjie Tong ,  Ahmad Shaaban ,  Adrian T. Jung ,  Jeremy M. Higgins ,  Ying Lin

IPC: C08G59/66 ,  C08G59/24 ,  C08K5/37 ,  C08K3/22 ,  C08K7/18 ,  C08K9/06 ,  C09J163/00 ,  H01M50/233 ,  H01M10/653

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.