Polymeric Material Including a Uretdione-Containing Material and Inorganic Filler, Two-Part Compositions, Products, and Methods

    公开(公告)号:US20220396659A1

    公开(公告)日:2022-12-15

    申请号:US17771905

    申请日:2020-12-14

    摘要: The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and an inorganic filler. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The present disclosure also provides a two-part composition, in which the polymeric material is included in the first part and the second part includes at least one amine. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

    Curable and cured compositions
    3.
    发明授权

    公开(公告)号:US11193016B2

    公开(公告)日:2021-12-07

    申请号:US17250019

    申请日:2019-04-25

    IPC分类号: C08L63/00 C09J163/00

    摘要: Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

    CURABLE COMPOSITIONS AND METHODS OF MAKING AND USING THE SAME

    公开(公告)号:US20220372290A1

    公开(公告)日:2022-11-24

    申请号:US17765744

    申请日:2020-11-06

    IPC分类号: C08L81/02 C09J181/02

    摘要: A two-part curable composition comprises: a Part A component comprising polythiol having a thiol group functionality of at least two, and tertiary amine accelerator; and a Part B component comprising polyene comprising at least two of non-aromatic C—C double bonds, C—C triple bonds, or a combination thereof and organic peroxide curative. At least one of the polythiol or the polyene comprises a respective reaction product of reaction components comprising: HSR1O(CH2CHR2O)aR1SH wherein each R1 independently represents an alkyl group having from 2 to 12 carbon atoms, each R2 independently represents H or CH3, and a represents an integer from 1 to 20; triallyl isocyanurate; H2═CHOR1O(CH2CHR2O)aR1OCH═CH2; and. A method of making a curable composition comprises combining the Part A and Part B components of the two-part curable composition. Methods of sealing a substrate and adhering two substrates, and articles made thereby are also disclosed. (Formula AA)

    CURABLE PRECURSOR OF A THERMALLY-CONDUCTIVE ADHESIVE COMPOSITION

    公开(公告)号:US20220243102A1

    公开(公告)日:2022-08-04

    申请号:US17607279

    申请日:2020-04-22

    摘要: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.

    CURABLE AND CURED COMPOSITIONS
    8.
    发明申请

    公开(公告)号:US20210122915A1

    公开(公告)日:2021-04-29

    申请号:US17250019

    申请日:2019-04-25

    IPC分类号: C08L63/00 C09J163/00

    摘要: Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.