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    TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND TWO-COMPONENT THERMALLY CONDUCTIVE GAP-FILLING GLUE
    4.
    发明公开
    TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND TWO-COMPONENT THERMALLY CONDUCTIVE GAP-FILLING GLUE 审中-公开

    公开(公告)号：US20240228839A1

    公开(公告)日：2024-07-11

    申请号：US18002113

    申请日：2021-06-16

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Lingjie Tong ,  Xiaohai Sheng ,  Ahmad Shaaban

    IPC分类号： C09J133/08 ,  C09J4/06 ,  C09J11/04 ,  C09J11/06

    CPC分类号： C09J133/08 ,  C09J4/06 ,  C09J11/04 ,  C09J11/06

    摘要： The present invention provides a two-component thermally conductive adhesive composition and a two-component thermally conductive gap-filling glue. The composition comprises: 8-38 wt % of an acrylate monomer or a combination of an acrylate monomer and an acrylate oligomer, with a glass transition temperature ranging from −80° C. to −10° C.: 0.2-4 wt % of a peroxide oxidant: 0.05-1 wt % of a peroxide decomposition promoter; and 60-90 wt % of a thermally conductive filler, wherein the two-component thermally conductive adhesive composition comprises Part A and Part B. Part A comprises a peroxide oxidant and Part B comprises a peroxide decomposition promoter: the acrylate monomer, or the combination of the acrylate monomer and the acrylate oligomer, and the thermally conductive filler exist in one or both of Part A and Part B. The products of the two-component thermally conductive adhesive composition and the two-component thermally conductive gap-filling glue after curing have a high elongation-at-break, high thermal conductivity and low bonding strength to aluminum metal surfaces, and are suitable for use as a thermally conductive gap-filling material in the battery pack module of an electro-mobile.

    CURABLE PRECURSOR OF A THERMALLY-CONDUCTIVE ADHESIVE COMPOSITION
    5.
    发明申请
    CURABLE PRECURSOR OF A THERMALLY-CONDUCTIVE ADHESIVE COMPOSITION 有权

    公开(公告)号：US20220243102A1

    公开(公告)日：2022-08-04

    申请号：US17607279

    申请日：2020-04-22

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Ahmad Shaaban ,  Adrian Jung ,  Manfred Ludsteck ,  Adrian Eckert ,  Li Yao ,  Simon Plugge ,  Lingjie Tong

    IPC分类号： C09J133/08 ,  C09J133/10 ,  C08K3/22 ,  C08F220/18 ,  C08F220/06 ,  C08F220/28 ,  C08F222/10 ,  C08F230/02

    摘要： The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.