公开(公告)号：US20170051185A1

公开(公告)日：2017-02-23

申请号：US15119626

申请日：2015-02-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Shiow Shya Ling ,  Ranjith Divigalpitiya ,  Kam Poi Chia ,  Carol A. Marek ,  Gerrard A. Marra

IPC: C09J7/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/40 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C09J133/08 ,  B32B27/20

CPC classification number: C09J133/08 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/536 ,  B32B2307/554 ,  B32B2307/584 ,  B32B2405/00 ,  C09J7/20 ,  C09J7/22 ,  C09J7/243 ,  C09J7/38 ,  C09J7/50 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2423/106 ,  C09J2433/003 ,  H05K13/0084

Abstract: Multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface and an adhesive layer on the other surface, with a conductive film construction adhered to a portion of the adhesive layer such that portions of the adhesive remain exposed. The conductive film construction includes a polymeric substrate with an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite coated by buff coating. Other multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface, and an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite particles coated on the other surface. Stripes of adhesive are present on a portion of the electrically conductive coating such that portions of the electrically conductive coating remain exposed between the adhesive stripes. Carrier tapes include a plurality of indented segments for accommodating electronic components and are releasably sealed by a cover tape.

Abstract translation: 多层覆盖带结构包括在一个表面上具有低粘附性背景涂层和在另一表面上的粘合剂层的聚合物基材，其中导电膜结构粘附到粘合剂层的一部分，使得粘合剂的部分保持暴露 。 导电膜结构包括具有通过抛光涂层涂覆的耐磨，导电的纳米级石墨的暴露层的聚合物基材。 其它多层覆盖带结构包括在一个表面上具有低粘附性背景涂层的聚合物基材和涂覆在另一表面上的耐磨，导电的纳米级石墨颗粒的暴露层。 粘合剂条纹存在于导电涂层的一部分上，使得导电涂层的一部分保持暴露在粘合剂条之间。 载带包括多个用于容纳电子部件的凹入部分，并且由盖带可释放地密封。