公开(公告)号：US11066753B2

公开(公告)日：2021-07-20

申请号：US15736531

申请日：2016-06-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Larry S. Hebert ,  David A. Sowatzke ,  Steven Y. Yu ,  Gene B. Nesmith

IPC: B32B15/04 ,  C25D5/56 ,  C23C28/02 ,  C23C28/00 ,  C23C14/20 ,  B32B15/20 ,  C25D3/38 ,  C23C18/16 ,  C23C18/54 ,  C25D3/30

Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.

公开(公告)号：US20210310145A1

公开(公告)日：2021-10-07

申请号：US17349168

申请日：2021-06-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Larry S. Hebert ,  David A. Sowatzke ,  Steven Y. Yu ,  Gene B. Nesmith

IPC: C25D5/56 ,  C23C28/02 ,  C23C28/00 ,  C23C14/20 ,  B32B15/04 ,  B32B15/20

Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.

公开(公告)号：US20180187323A1

公开(公告)日：2018-07-05

申请号：US15736531

申请日：2016-06-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Larry S. Hebert ,  David A. Sowatzke ,  Steven Y. Yu ,  Gene B. Nesmith

IPC: C25D5/56 ,  C23C28/02 ,  C23C28/00 ,  C23C14/20

CPC classification number: C25D5/56 ,  C23C14/205 ,  C23C18/1653 ,  C23C18/54 ,  C23C28/023 ,  C23C28/42 ,  C25D3/30 ,  C25D3/38

Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.