UV-CURABLE SEMI-STRUCTURAL ADHESIVE, AND UV-CURABLE SEMI-STRUCTURAL ADHESIVE TAPE

    公开(公告)号:US20230348763A1

    公开(公告)日:2023-11-02

    申请号:US18044409

    申请日:2021-08-11

    Abstract: The present invention provides a UV-curable semi-structural adhesive, and a UV-curable semi-structural adhesive tape. The UV-curable semi-structural adhesive comprises: 30-80 parts by weight of a polymer base material comprising a product prepared by polymerization of an (meth)acrylate composition; 20-70 parts by weight of an epoxy resin; and a photoacid generator, wherein the (meth)acrylate composition comprises: 40-65 parts by weight of a first (meth)acrylate monomer containing a secondary hydroxyl group; 35-60 parts by weight of a second (meth)acrylate monomer; and a free-radical polymerization photoinitiator. The (meth)acrylate composition does not gel when used in the package-sealed UV polymerization process for producing semi-structural adhesives, and have good compatiility with epoxy composition, enabling the production of semi-structural adhesives through a solvent-free process. In addition, the UV-curable semi-structural adhesive is in a paste state and forms a thick adhesive film on the substrate through one-time coating, simplifying the operation and allowing the adhesive layer formed after UV curing to have high adhesion strength.

    Pressure-sensitive adhesive composition, conductive adhesive composition and adhesive tape made therefrom

    公开(公告)号:US09920226B2

    公开(公告)日:2018-03-20

    申请号:US15022003

    申请日:2014-09-23

    Abstract: The present invention provides a thermally curable pressure-sensitive adhesive composition, which, based on the total weight of the composition, comprises the following components: a) 35-99% by weight of a reactive polymethacrylate component having a glass transition temperature Tg of −35° C. to 32° C., and having a reactive functional group which can react with benzoxazine to form an interpenetrating polymer network; and b) 1-65% by weight of a benzoxazine component of the following formula: wherein: X is selected from the group consisting of a covalent bond, C1-C6 alkylene, C3-C10 cycloalkylene group, C═O, S, S═O or O═S═O R1 and R2 are the same or different and independently of each other selected from the group consisting of hydrogen, C1-C6 alkyl, or C5-C14 aryl, and R4 is selected from the group consisting of hydrogen, halogen or C1-C6 alkyl. The present invention also provides an electrically conductive adhesive composition and an adhesive tape comprising the above-described composition, and provides for the use of the composition for preparing membranes used for electronic and electrical products, automobile products and new energy equipment.

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