公开(公告)号：US20200259137A1

公开(公告)日：2020-08-13

申请号：US16753897

申请日：2018-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Li Yao ,  Rajdeep S. Kalgutkar ,  Mario A. Perez ,  Jeremy M. Higgins ,  Taesung Kim ,  Brett A. Beiermann

IPC: H01M2/10 ,  C08G59/54 ,  C09K5/14 ,  C09J163/00 ,  C09J9/00 ,  H01M10/653 ,  H01M10/625

Abstract: A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that includes an epoxy resin.