Cooling system for a substrate
    6.
    发明申请
    Cooling system for a substrate 审中-公开
    衬底冷却系统

    公开(公告)号:US20060262503A1

    公开(公告)日:2006-11-23

    申请号:US11315792

    申请日:2005-12-22

    IPC分类号: H05K7/20

    摘要: The present invention relates to a cooling system, the cooling system having a nozzle which receives coolant from a reservoir and which faces a substrate. The nozzle may be opened and closed by a thermally responsive valve allowing the coolant to be automatically metered to the substrate, thus controlling the spatial distribution of the coolant that is applied to the substrate. This approach allows hotter areas of the substrate to receive more coolant, thus eliminating nonuniformities in the thermal profile of the substrate.

    摘要翻译: 冷却系统本发明涉及一种冷却系统,该冷却系统具有一个从容器接收冷却剂并面向衬底的喷嘴。 喷嘴可以由热响应阀打开和关闭,允许冷却剂自动计量到基板,从而控制施加到基板的冷却剂的空间分布。 该方法允许衬底的较热区域接收更多的冷却剂,从而消除衬底的热分布中的不均匀性。