公开(公告)号：US20150351241A1

公开(公告)日：2015-12-03

申请号：US14759618

申请日：2013-12-17

Applicant: A.L.M.T. CORP.

Inventor： Yoshiyuki Hirose ,  Sachie Sugitani ,  Norihito Goma ,  Gouhei Toyoshima ,  Noboru Uenishi

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  B22F2998/10 ,  B23K35/0233 ,  B23K35/262 ,  B32B15/00 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C14/00 ,  C22C27/04 ,  H01L23/15 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/18 ,  H05K3/4061 ,  Y10T29/49126 ,  H01L2924/00 ,  B22F7/004 ,  B22F3/26

Abstract: A ceramic wiring substrate and method for manufacturing the same, the substrate having an up-and-down conduction body which is made by forming a porous structure body from a high melting point metal and then infiltrating a low-resistance metal in an up-and-down conduction hole subsequently formed in a substrate made in a plate shape through sintering a ceramic precursor, the conduction body having a normal composite structure without an abnormally grown particle, a void, a crack and the like and not having a problem of falling off from the substrate, as well as provided a semiconductor device using this substrate. An intermediate layer formed of at least one selected from a group of Mo, W, Co, Fe, Zr, Re, Os, Ta, Nb, Ir, Ru and Hf is formed on an inner surface of the up-and-down conduction hole of the substrate before being provided with the conduction body having the composite structure.

Abstract translation: 一种陶瓷布线基板及其制造方法，所述基板具有上下导体，其通过从高熔点金属形成多孔结构体，然后在上下方向上渗入低电阻金属而制成 随后在通过烧结陶瓷前体而制成板状的基板中形成的导通体，导电体具有正常的复合结构，而没有异常生长的颗粒，空隙，裂纹等，并且不具有脱落的问题 并且提供使用该衬底的半导体器件。 在上下传导的内表面上形成由选自Mo，W，Co，Fe，Zr，Re，Os，Ta，Nb，Ir，Ru和Hf中的至少一种形成的中间层 在提供具有复合结构的导体之前，衬底的孔。