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公开(公告)号：US20240217809A1
公开(公告)日：2024-07-04
申请号：US18454038
申请日：2023-08-22
发明人： Zhuanzhuan Zhao , Kaijie Wang , Rui Zhang
IPC分类号： B81B3/00
CPC分类号： B81B3/0056 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81B2203/0353
摘要： A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.
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公开(公告)号：US20240155296A1
公开(公告)日：2024-05-09
申请号：US18454042
申请日：2023-08-22
发明人： Zhuanzhuan Zhao , Linlin Wang , Kaijie Wang , Rui Zhang
CPC分类号： H04R19/04 , H04R7/04 , H04R7/18 , H04R2201/003
摘要： A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.
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公开(公告)号：US20240073625A1
公开(公告)日：2024-02-29
申请号：US18072661
申请日：2022-11-30
发明人： Kaijie Wang , Zhuanzhuan Zhao
摘要： A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.
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公开(公告)号：US12126959B2
公开(公告)日：2024-10-22
申请号：US17970585
申请日：2022-10-21
发明人： Linlin Wang , Zhuanzhuan Zhao , Kaijie Wang , Zhengyu Shi , Minh Ngoc Nguyen , Rui Zhang
CPC分类号： H04R19/005 , H04R19/04 , H04R31/003
摘要： The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.
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公开(公告)号：US20220353621A1
公开(公告)日：2022-11-03
申请号：US17566611
申请日：2021-12-30
发明人： Kaijie Wang , Linlin Wang
摘要： One of the main objects of the present invention is to provide a silicon microphone that is reasonably designed and can effectively improve electroacoustic performance. To achieve the above-mentioned objects, the present invention provides a silicon microphone including a substrate with a back cavity; and a capacitor system attached to and insulated from the substrate. The capacitor system includes a diaphragm and a back plate spaced from the diaphragm. At least one through hole is formed in the back plate. The diaphragm includes a vibration part in a middle thereof and a fixed part surrounding and spaced from the vibration part by a first slit. An orthographic projection of the vibration part on the substrate partially overlaps with the substrate thereby forming a second slit between the vibration part and the substrate and communicating with the first slit and the back cavity, respectively.
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公开(公告)号：US20240080632A1
公开(公告)日：2024-03-07
申请号：US18091346
申请日：2022-12-29
发明人： Linlin Wang , Rui Zhang , Kaijie Wang , Zhuanzhuan Zhao , Minh Ngoc Nguyen
CPC分类号： H04R19/04 , H04R7/14 , H04R2201/003
摘要： A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.
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公开(公告)号：US20240073626A1
公开(公告)日：2024-02-29
申请号：US18072669
申请日：2022-11-30
发明人： Kaijie Wang , Zhuanzhuan Zhao
CPC分类号： H04R19/04 , H04R1/083 , H04R7/18 , H04R31/003
摘要： A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.
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公开(公告)号：US20230353950A1
公开(公告)日：2023-11-02
申请号：US17970585
申请日：2022-10-21
发明人： Linlin Wang , Zhuanzhuan Zhao , Kaijie Wang , Zhengyu Shi , Minh Ngoc Nguyen , Rui Zhang
CPC分类号： H04R19/005 , H04R19/04 , H04R31/003
摘要： The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.
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公开(公告)号：US20240073610A1
公开(公告)日：2024-02-29
申请号：US18072657
申请日：2022-11-30
发明人： Kaijie Wang , Zhuanzhuan Zhao , Linlin Wang
CPC分类号： H04R7/14 , H04R1/083 , H04R2410/07
摘要： A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.
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