Abstract:
An arrangement for reading out an analog voltage signal includes a voltage signal input for applying the analog voltage signal thereto, a reference unit configured to generate an analog reference voltage, and a converting unit configured to convert an analog input signal into a digital output signal. To enable online self-calibration of the arrangement, the arrangement includes a superposition unit configured to receive the analog voltage signal and the analog reference voltage. The superposition unit includes a modulation unit configured to generate a modulated reference voltage from the analog reference voltage. The superposition unit is configured to generate a combined analog signal by superimposing the modulated reference voltage onto the analog voltage signal, and to forward the combined analog signal to the converting unit.
Abstract:
The present invention relates to a method for determining an actual junction temperature (Tj) and/or an actual collector current (Ic) of an IGBT device, wherein the IGBT device has a main emitter (EM) and an auxiliary emitter (EA), comprising the steps of; measuring the characteristics of an emitter voltage drop (VEE′) as a difference between a main emitter voltage (VE) at the main emitter (EM) and an auxiliary emitter voltage (VE′) at the auxiliary emitter (EA) during a switching operation of the IGBT device; and determining the junction temperature and/or the collector current (IC) based on the characteristics of the emitter voltage drop (VEE′).
Abstract:
An arrangement for reading out an analog voltage signal includes a voltage signal input for applying the analog voltage signal thereto, a reference unit configured to generate an analog reference voltage, and a converting unit configured to convert an analog input signal into a digital output signal. To enable online self-calibration of the arrangement, the arrangement includes a superposition unit configured to receive the analog voltage signal and the analog reference voltage. The superposition unit includes a modulation unit configured to generate a modulated reference voltage from the analog reference voltage. The superposition unit is configured to generate a combined analog signal by superimposing the modulated reference voltage onto the analog voltage signal, and to forward the combined analog signal to the converting unit.
Abstract:
The present invention relates to a method for determining an actual junction temperature (Tj) and/or an actual collector current (IC) of an IGBT device, wherein the IGBT device has a main emitter (EM) and an auxiliary emitter (EA), comprising the steps of; measuring the characteristics of an emitter voltage drop (VEE′) as a difference between a main emitter voltage (VE) at the main emitter (EM) and an auxiliary emitter voltage (VE′) at the auxiliary emitter (EA) during a switching operation of the IGBT device; and determining the junction temperature and/or the collector current (IC) based on the characteristics of the emitter voltage drop (VEE′).