公开(公告)号：US09984953B2

公开(公告)日：2018-05-29

申请号：US14442049

申请日：2012-12-07

Applicant: ABB Technology Ltd

Inventor： Olle Ekwall ,  Erik Doré ,  Franc Dugal ,  Raffael Schnell

IPC: H01L23/40 ,  H01L25/07 ,  H01L25/16 ,  H02M7/00 ,  H05K7/20 ,  H01L23/473 ,  H01L23/00 ,  H01L23/367 ,  H01L25/11

CPC classification number: H01L23/4012 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/72 ,  H01L25/071 ,  H01L25/074 ,  H01L25/117 ,  H01L25/16 ,  H01L2023/4031 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H02M7/003 ,  H05K7/209 ,  H01L2924/00

Abstract: A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.