LASER CUTTING PROCESS MONITORING AND CONTROL
    1.
    发明申请
    LASER CUTTING PROCESS MONITORING AND CONTROL 审中-公开
    激光切割工艺监控与控制

    公开(公告)号:US20140263220A1

    公开(公告)日:2014-09-18

    申请号:US14212086

    申请日:2014-03-14

    Inventor: Li Chen Yongjin Xie

    CPC classification number: B23K26/032 A61F2/91 A61F2/915 B23K26/38

    Abstract: A laser system including various optical components providing for beam alignment and process monitoring of a stent cutting process is described. The various aspects of the invention provide for monitoring of a beam of laser light reflected from the surface of a stent tube so as monitor the properties of the cutting beam, location of the beam, system cleanliness, optical defects in the system, and cutting efficiency of the laser.

    Abstract translation: 描述了包括提供支架切割过程的光束对准和过程监控的各种光学部件的激光系统。 本发明的各个方面提供了用于监测从支架管表面反射的激光束,以便监测切割梁的性质,光束位置,系统清洁度,系统中的光学缺陷以及切割效率 的激光。

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