公开(公告)号：US11261338B2

公开(公告)日：2022-03-01

申请号：US16671758

申请日：2019-11-01

申请人： AC PRODUCTS, INC.

发明人： David Tomlinson ,  Bryan Vu ,  James Wichmann ,  Peter Weissman ,  Gregory Dancy ,  Thomas Farrell

IPC分类号： C09D9/00 ,  C09D175/04 ,  C09D175/02 ,  C23C18/26 ,  C23F1/14

摘要： A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.

公开(公告)号：US12024649B2

公开(公告)日：2024-07-02

申请号：US17577592

申请日：2022-01-18

申请人： AC PRODUCTS, INC.

发明人： David Tomlinson ,  Bryan Vu ,  James Wichmann ,  Peter Weissman ,  Gregory Dancy ,  Thomas Farrell

IPC分类号： C09D9/00 ,  C09D175/02 ,  C09D175/04 ,  C23C18/26 ,  C23F1/14

CPC分类号： C09D9/005 ,  C09D175/02 ,  C09D175/04 ,  C23C18/26 ,  C23F1/14

摘要： A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.

公开(公告)号：US20240166829A1

公开(公告)日：2024-05-23

申请号：US18493335

申请日：2023-10-24

申请人： AC Products Inc.

发明人： Thomas P. Farrell ,  Bryan Vu ,  David Tomlinson ,  Peter Weissman

IPC分类号： C08J5/18 ,  B32B15/082 ,  B32B15/20 ,  B32B27/18 ,  B32B27/30 ,  C23C14/04 ,  C23C14/24 ,  C23C16/04 ,  C23C18/16

CPC分类号： C08J5/18 ,  B32B15/082 ,  B32B15/20 ,  B32B27/18 ,  B32B27/302 ,  C23C14/042 ,  C23C14/24 ,  C23C16/042 ,  C23C18/1605 ,  B29C48/154 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/54 ,  C08J2347/00 ,  C08J2423/22

摘要： In one aspect, the present disclosure provides a polymer film with a low glass transition temperature. In one embodiment, when in contact with a metal substrate, the polymer film adheres to the metal substrate under heating and/or mechanical pressure. In one embodiment, the polymer film comprises a butadiene copolymer and a butylene polymer. In another aspect, the present disclosure further provides a method of masking a metal substrate using the polymer film. In yet another aspect, the present disclosure provides a method of chemically or electrochemically processing a metal substrate that is masked with the polymer film.