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公开(公告)号：US12097709B2
公开(公告)日：2024-09-24
申请号：US17612452
申请日：2020-05-22
Applicant: General Electric Company
Inventor： William C. Alberts , Vadim Bromberg , Kwok Pong Chan , Robert Edgar Estes , Jacob Mayer , Joshua Tyler Mook , Janet Mekker , William Cosmo Murphy , Arunkumar Natarajan , Mary Kathryn Thompson , Xi Yang , Travis Sands
CPC classification number: B41J2/16552 , B22F10/14 , B22F10/38 , B22F10/70 , B22F12/90 , B41J2/16538 , C09D9/005 , C09D11/107 , C09D11/30 , B41J2002/16558
Abstract: Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.
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公开(公告)号：US12031061B2
公开(公告)日：2024-07-09
申请号：US16905047
申请日：2020-06-18
Applicant: W.M. Barr & Company, Inc.
Inventor： Alana Byrd
CPC classification number: C09D9/005 , C08K3/22 , C08K5/05 , C08K5/06 , C08K5/09 , C08K5/3415 , C08K5/42 , C09D9/04
Abstract: A composition for paint or spot removal having a carrier, a chemical component selected from the group consisting of Tetraoxaundecane (TOU), N-Methyl-2-pyrrolidone (NMP), Diethylene Glycol Monobutyl Ether, Ethylene Glycol Phenyl Ether, Propylene Glycol Phenyl Ether, Dipropylene Glycol N-Butyl Ether, and a combination thereof, and a co-solvent. A method of using the composition to remove a stain or spot from a carpet or other non-porous or hard surface is provided.
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公开(公告)号：US20240076510A1
公开(公告)日：2024-03-07
申请号：US18385600
申请日：2023-10-31
Applicant: W. M. BARR & COMPANY, INC
Inventor： Jonathan P. Breon , Timothy G. Teague , Dennis Earl Shireman
IPC: C09D9/00
CPC classification number: C09D9/005
Abstract: A composition for paint removal and methods of making and of using the composition are provided. The composition comprises tetrahydrofuran (THF), an amine with a molar volume of
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公开(公告)号：US20240043601A1
公开(公告)日：2024-02-08
申请号：US18354764
申请日：2023-07-19
Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
Inventor： Erick B. Iezzi , Keith B. Sutyak , Grant C. Daniels , Eugene Camerino
CPC classification number: C08G18/3893 , C08G18/10 , C08G18/307 , C08K5/544 , C09D183/08 , C09D9/005 , C08K5/19 , C08K3/16 , C08G2150/00
Abstract: Disclosed herein is a method and thermoset made by: reacting a di- or tri-functional isocyanate with a silyl-containing compound to form a polyurethane having at least one unreacted isocyanate group, reacting the polyurethane with an aminoalkylalkoxysilane to form an alkoxysilane-terminated polyurethane, and moisture-curing the alkoxysilane-terminated polyurethane to form the thermoset. The silyl-containing compound has the formula: SiR1n[R3—(O—CO—X—R3)m—OH]4-n. Each X is —O— or —NR2—; each R1 is an alkyl group or an aryl group; each R2 is —H, an alkyl group, or an aryl group; each R3 is an alkylene group; n is 0, 1, or 2; and each m is a non-negative integer. The thermoset may be degraded by treatment with a solution of a fluoride salt in an organic solvent.
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公开(公告)号：US11827812B2
公开(公告)日：2023-11-28
申请号：US17339446
申请日：2021-06-04
Applicant: W. M. Barr & Company, Inc.
Inventor： Jonathan P. Breon , Timothy G. Teague , Dennis Earl Shireman
IPC: C09D9/00
CPC classification number: C09D9/005
Abstract: A composition for paint removal and methods of making and of using the composition are provided. The composition comprises tetrahydrofuran (THF), an amine with a molar volume of
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Patent Agency Ranking
公开(公告)号：US11708502B2
公开(公告)日：2023-07-25
申请号：US16011164
申请日：2018-06-18
Applicant: W.M. Barr & Company, Inc.
Inventor： Charles L. Hawes , Tim Teague
Abstract: A composition for paint removal and methods of making and of using the composition are provided. The paint remover composition comprises a component selected from the group consisting of THF, toluene, acetone, DMSO, dioxalane, 1,2 trans dichloroethylene, and a combination thereof.
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7.发明申请公开(公告)号：US20190189301A1
公开(公告)日：2019-06-20
申请号：US16323095
申请日：2017-08-02
Inventor： Alban GOSSARD , Fabien FRANCES
CPC classification number: G21F9/001 , B01J20/12 , B01J20/18 , B01J20/28047 , B08B7/04 , C08K5/0008 , C09D7/20 , C09D7/43 , C09D9/00 , C09D9/005 , C11D3/40 , C11D7/02 , C11D7/20 , C11D7/24 , C11D7/5027 , C11D17/00 , C11D17/003 , G21F9/002 , G21F9/30 , Y02P20/582
Abstract: A suctionable gel for eliminating a contaminating species contained in an organic layer on the surface of a material, consisting of a colloidal solution comprising, preferably consisting of: 1 wt % to 25 wt %, preferably 5 wt % to 20 wt % based on the total weight of the gel, of at least one inorganic viscosifying agent; 13 wt % to 99 wt %, preferably 80 wt % to 95 wt % based on the total weight of the gel, of an organic solvent selected among the terpenes and the mixtures thereof; optionally, 0.01 wt % to 10 wt %, based on the total weight of the gel, of at least one dye and/or pigment; optionally 0.1 wt % to 2 wt %, based on the total weight of the gel, of at least one surfactant. The disclosure further relates to a decontamination method using the gel.
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公开(公告)号：US20180155557A1
公开(公告)日：2018-06-07
申请号：US15645461
申请日：2017-07-10
Applicant: Packaging Service Co., Inc.
Inventor： John S. Ledford , Lynn Place , Jean-Pierre Baizan , Mark Vorderbruggen
CPC classification number: C09D9/02 , B08B3/08 , B08B7/0014 , B08B2220/01 , C09D9/005 , C09D9/04
Abstract: Abrasive paint remover compositions including a solvent system or composition and an abrasive system or composition and methods for making and using same, where the compositions may be formulated with no methylene chloride (MC).
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公开(公告)号：US20170267879A1
公开(公告)日：2017-09-21
申请号：US15454599
申请日：2017-03-09
Applicant: Shizuka KOHZUKI , Akiko BANNAI
Inventor： Shizuka KOHZUKI , Akiko BANNAI
CPC classification number: C09D9/005 , B41J2/16535 , B41J2/16552 , B41J2002/1655 , B41J2002/16558 , C09D9/00 , C09D9/04 , C09D11/10 , C09D11/107 , C09D11/322 , C09D11/54
Abstract: Provided is cleaning solution used for cleaning ink containing water and resin, cleaning solution containing water and solvent. Solvent contains glycol ether compound represented by general formula 1. Ink film obtained by drying the ink has swelling ratio of 20 percent or higher but 150 percent or lower, where swelling ratio is calculated by mathematical formula 1 based on masses of ink film before/after immersed in cleaning solution at 25 degrees C. for 24 hours, R1(OR2)XOR3 General formula 1 In general formula 1, R1 and R3 represent hydrogen atom or alkyl group including from 1 through 4 carbon atoms, R2 represents alkyl group including from 2 through 3 carbon atoms, and X represents integer of from 1 through 4, Swelling ratio (%)=100×[(B−A)/A] Mathematical formula 1 In mathematical formula 1, A represents mass of ink film before immersed, and B represents mass of ink film after immersed.
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10.发明申请公开(公告)号：US20170158888A1
公开(公告)日：2017-06-08
申请号：US15369859
申请日：2016-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： In-goo KANG , Sung-bae KIM , Baik-soon CHOI , Sue-ryeon KIM , Young-taek HONG , Sang-tae KIM , Kyong-ho LEE , Hyung-pyo HONG , Seong-min KIM
IPC: C09D9/00 , B32B37/00 , B32B43/00 , H01L21/683 , C09J183/04
CPC classification number: C09D9/005 , B32B37/0046 , B32B43/006 , B32B2383/00 , B32B2457/14 , C09D9/04 , C09J183/04 , H01L21/31111 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L24/00 , H01L25/0657 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/16145 , H01L2224/16225 , H01L2924/15311 , H01L2924/181 , H01L2924/00012
Abstract: Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.
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