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公开(公告)号：US11606156B1
公开(公告)日：2023-03-14
申请号：US16857584
申请日：2020-04-24
Applicant: Acacia Communications, Inc.
Inventor： James Duda , Jon Stahl , Kevin Hinchey
IPC: H04B10/00 , H04J3/06 , H03L7/081 , H04L43/106
Abstract: A method, system, and apparatus for determining delay between clocks, in response to a trigger event, buffering DSP symbol information in a symbol capture buffer; wherein the amount of DSP symbol information buffered corresponds to the amount of symbols captured during a buffer storage interval; and extracting a synchronization packet from the symbol capture buffer.
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公开(公告)号：US09874688B2
公开(公告)日：2018-01-23
申请号：US13871331
申请日：2013-04-26
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Eric Swanson , Diedrik Vermeulen , Saeid Azemati , Jon Stahl
CPC classification number: G02B6/12 , G02B6/4269 , G02B6/428 , H01L2224/16225
Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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公开(公告)号：US09557478B2
公开(公告)日：2017-01-31
申请号：US14012876
申请日：2013-08-28
Applicant: ACACIA COMMUNICATIONS INC.
Inventor： Christopher Doerr , Eric Swanson , Jon Stahl , Diedrik Vermeulen
Abstract: Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.
Abstract translation: 本文公开了用于集成光子集成电路（PIC），包括驱动器和跨阻抗放大器（TIAs）的电子集成电路和具有模数转换器的ASIC和定位的数字信号处理器的共同封装结构，器件和方法 在相同的载体上，从而导致紧凑的相干收发器，同时降低其成本。
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Patent Agency Ranking
公开(公告)号：US10819438B1
公开(公告)日：2020-10-27
申请号：US16364909
申请日：2019-03-26
Applicant: Acacia Communications, Inc.
Inventor： Jon Stahl , James Duda
Abstract: A system, apparatus, and method for an optical grooming network; wherein a set of switches form an optical grooming interconnection system where each switch is communicatively coupled to each other switch; a set of clients; where each switch of the set of switches is communicatively coupled to a client of the clients; wherein each client receiver is enabled to communicate through the set of switches to any client or modem; and a set of coherent optical modems; wherein each coherent optical modem is communicatively coupled to a switch of the set of switches; wherein each client of the clients is able to communicate through the set of switches to every coherent optical modem of the set of coherent optical modems, and each coherent optical modem in the set of coherent optical modems can communicate to every coherent optical modem of the set of coherent optical modems.
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5.发明申请公开(公告)号：US20180203187A1
公开(公告)日：2018-07-19
申请号：US15870468
申请日：2018-01-12
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Eric Swanson , Diedrik Vermeulen , Saeid Azemati , Jon Stahl
CPC classification number: G02B6/12 , G02B6/4269 , G02B6/428 , H01L2224/16225
Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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公开(公告)号：US12147073B1
公开(公告)日：2024-11-19
申请号：US16801789
申请日：2020-02-26
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Eric Swanson , Diedrik Vermeulen , Saeid Azemati , Jon Stahl
Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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公开(公告)号：US11228373B1
公开(公告)日：2022-01-18
申请号：US17080227
申请日：2020-10-26
Applicant: Acacia Communications, Inc.
Inventor： Jon Stahl , James Duda
Abstract: A system, apparatus, and method for an optical grooming network; wherein a set of switches form an optical grooming interconnection system where each switch is communicatively coupled to each other switch; a set of clients; where each switch of the set of switches is communicatively coupled to a client of the clients; wherein each client receiver is enabled to communicate through the set of switches to any client or modem; and a set of coherent optical modems; wherein each coherent optical modem is communicatively coupled to a switch of the set of switches; wherein each client of the clients is able to communicate through the set of switches to every coherent optical modem of the set of coherent optical modems, and each coherent optical modem in the set of coherent optical modems can communicate to every coherent optical modem of the set of coherent optical modems.
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公开(公告)号：US10578799B2
公开(公告)日：2020-03-03
申请号：US15870468
申请日：2018-01-12
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Eric Swanson , Diedrik Vermeulen , Saeid Azemati , Jon Stahl
Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
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