FLUIDIC CHANNELS AND METHODS OF ALTERING THE SURFACE ENERGY OF COMPONENTS THEREOF

    公开(公告)号:US20210404594A1

    公开(公告)日:2021-12-30

    申请号:US17465277

    申请日:2021-09-02

    申请人: ACULON, INC.

    摘要: A surface-treated fluidic channel is provided comprising a dispensing device that comprises a microarray of microchannels. The fluidic channel is made from metal and comprises a surface and a hydrophobic coating layer comprising a self-assembled monolayer of an organophosphorus acid adhered to the surface. A mesh nebulizer comprising a reservoir and a dispensing device comprising a microarray of microchannels is also provided. A metal surface layer is applied to the interior and exterior surfaces of the reservoir and dispensing device, and a hydrophobic coating layer comprising an organo-silicon or a self-assembled monolayer of an organophosphorus acid is adhered to the metal surface layer, usually on the exterior surfaces of the reservoir and dispensing device. A hydrophilic polymeric coating layer may be chemically bonded to and propagated from terminal functional groups on the hydrophobic coating layer on the interior surfaces of the reservoir and dispensing device.

    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARDS FORMED THEREBY

    公开(公告)号:US20220256713A1

    公开(公告)日:2022-08-11

    申请号:US17729254

    申请日:2022-04-26

    申请人: ACULON, INC.

    摘要: A method of manufacturing a printed circuit board is providedd, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C-F bond; and (c) a rheology modifying component. Also provided are electronic compoennts of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.