Thin film superconducting wire and superconducting cable conductor
    6.
    发明授权
    Thin film superconducting wire and superconducting cable conductor 有权
    薄膜超导线和超导电缆导体

    公开(公告)号:US09255320B2

    公开(公告)日:2016-02-09

    申请号:US13133274

    申请日:2009-12-03

    摘要: A thin film superconducting wire with a copper plating thin film produced on a surface of a laminated structure is inferior in bending properties to a thin film superconducting wire having no copper plating thin film. Therefore, a thin film superconducting wire according to the present invention is a thin film superconducting wire including a laminated structure having a substrate, a buffer layer located on one of main surfaces of the substrate, and a superconducting layer located on a main surface of the buffer layer opposite to a main surface facing the substrate. The thin film superconducting wire further includes a copper plating thin film covering an outer periphery of the laminated structure, a residual stress within the copper plating thin film serving as a compression stress. The laminated structure may have a sputtered silver layer. A silver covering layer covering the outer periphery of the laminated structure may be further provided between the copper plating thin film and the laminated structure.

    摘要翻译: 在层叠结构体的表面上形成有镀铜薄膜的薄膜超导线,对于不具有镀铜薄膜的薄膜超导线,弯曲性差。 因此,根据本发明的薄膜超导线是包括层叠结构的薄膜超导线,该层叠结构具有衬底,位于衬底的主表面之一的缓冲层和位于衬底的主表面上的超导层 缓冲层与面向衬底的主表面相对。 薄膜超导线还包括覆盖层叠结构的外周的镀铜薄膜,作为压电应力的镀铜薄膜内的残留应力。 层压结构可以具有溅射的银层。 覆盖层叠结构的外周的银覆盖层可以进一步设置在镀铜薄膜和层叠结构之间。

    PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM
    10.
    发明申请
    PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM 有权
    在介质上沉积金属图案的过程

    公开(公告)号:US20150305168A1

    公开(公告)日:2015-10-22

    申请号:US14647377

    申请日:2013-11-27

    摘要: Process of depositing a metallic pattern on a medium, said process comprising: generating pulsed laser beams from a pulsed laser source, wherein the laser beams have a wavelength for which the medium is substantially transparent, focussing the laser beams onto a target layer comprising inorganic particles, dispersed in a laser light degradable/combustible organic matrix, said target layer producing ejecta in response to an interaction of said laser beams and said target layer, accumulating at least a portion of said ejecta on said medium within the desired pattern, providing the pattern by electroless metal plating. The invention further relates to a transparent medium comprising a metallic pattern wherein the adhesion between the metallic pattern and the medium is at least 5N/cm.

    摘要翻译: 在介质上沉积金属图案的过程,所述方法包括:从脉冲激光源产生脉冲激光束,其中激光束具有介质基本上透明的波长,将激光束聚焦到包含无机颗粒的靶层上 ,分散在激光可降解/可燃的有机基质中,所述目标层响应于所述激光束和所述目标层的相互作用而产生喷射,在所述图案内将所述介质的至少一部分积聚在所述介质上, 通过无电镀金属电镀。 本发明还涉及包含金属图案的透明介质,其中金属图案和介质之间的粘附力为至少5N / cm。