公开(公告)号：US20230120305A1

公开(公告)日：2023-04-20

申请号：US17965888

申请日：2022-10-14

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHIA-HAO CHENG ,  RAHUL AGARWAL ,  CHINTAN BUCH ,  ARSALAN ALAM

IPC: H01L21/66 ,  H01L23/48 ,  H01L23/00 ,  H01L21/463 ,  H01L21/465 ,  H01L21/3205

Abstract: A method includes applying a temporary pad to a conductive pad of a semiconductor die. After testing the semiconductor die, the temporary pad is removed from the conductive pad.

公开(公告)号：US20210313269A1

公开(公告)日：2021-10-07

申请号：US17323454

申请日：2021-05-18

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： MILIND S. BHAGAVAT ,  RAHUL AGARWAL ,  CHIA-HAO CHENG

IPC: H01L23/528 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56 ,  H01L25/065

Abstract: Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.