公开(公告)号：US20230207546A1

公开(公告)日：2023-06-29

申请号：US17564123

申请日：2021-12-28

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： ARSALAN ALAM ,  FEI GUO ,  RAHUL AGARWAL

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L25/18 ,  H01L21/56 ,  H01L25/50 ,  H01L25/105 ,  H01L25/0652 ,  H01L24/05

Abstract: A semiconductor device includes a power delivery device die stack including a plurality of vertically arranged power delivery device dies. The plurality of power delivery device dies including at least a first power delivery device die and a second power delivery device die electrically connected to the first power delivery device die. The semiconductor device includes at least one external interconnect for providing a power input to the power delivery device die stack and at least one external interconnect for supplying a power output from the power delivery device die stack.

公开(公告)号：US20230120305A1

公开(公告)日：2023-04-20

申请号：US17965888

申请日：2022-10-14

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHIA-HAO CHENG ,  RAHUL AGARWAL ,  CHINTAN BUCH ,  ARSALAN ALAM

IPC: H01L21/66 ,  H01L23/48 ,  H01L23/00 ,  H01L21/463 ,  H01L21/465 ,  H01L21/3205

Abstract: A method includes applying a temporary pad to a conductive pad of a semiconductor die. After testing the semiconductor die, the temporary pad is removed from the conductive pad.