公开(公告)号：US11917794B2

公开(公告)日：2024-02-27

申请号：US17085324

申请日：2020-10-30

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Andrew G. Kegel ,  Jeffrey Bialozor

IPC: H05K7/20 ,  H01L23/44 ,  H05K1/02

CPC classification number: H05K7/20372 ,  H01L23/445 ,  H05K1/0203 ,  H05K1/0207 ,  H05K7/205

Abstract: Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.