利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

58 条记录 (耗时 0.015 秒)

    Liquid cooling server deployment and delivery apparatus and operation
    2.
    发明授权
    Liquid cooling server deployment and delivery apparatus and operation 有权

    公开(公告)号：US11943900B2

    公开(公告)日：2024-03-26

    申请号：US17448611

    申请日：2021-09-23

    申请人： Baidu USA LLC

    发明人： Tianyi Gao

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20663 ,  H05K7/20327 ,  H05K7/20372 ,  F25B2345/00 ,  F25B2345/006 ,  H05K7/20318 ,  H05K7/20354

    摘要： A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

    Systems and methods for cooling a computing system
    4.
    发明授权
    Systems and methods for cooling a computing system 有权

    公开(公告)号：US11675400B2

    公开(公告)日：2023-06-13

    申请号：US16740998

    申请日：2020-01-13

    申请人： Microsoft Technology Licensing, LLC

    发明人： Husam A. Alissa ,  Eric Clarence Peterson

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/20172 ,  H05K7/20309 ,  H05K7/20327 ,  H05K7/20372 ,  G06F2200/201

    摘要： A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.

    PCB CURRENT TRACK COOLING IN ELECTRICAL CLIMATE COMPRESSORS
    5.
    发明申请
    PCB CURRENT TRACK COOLING IN ELECTRICAL CLIMATE COMPRESSORS 审中-公开
    电气气候压缩机PCB电流跟踪冷却

    公开(公告)号：US20170027052A1

    公开(公告)日：2017-01-26

    申请号：US15217057

    申请日：2016-07-22

    申请人： Hanon Systems

    发明人： Stephan Werker ,  Holger Gerberich ,  Mario Lenz

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0201 ,  H05K1/0203 ,  H05K1/0296 ,  H05K1/181 ,  H05K7/20218 ,  H05K7/20372 ,  H05K7/20418 ,  H05K7/20936 ,  H05K2201/064 ,  H05K2201/10409

    摘要： An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within a circuit board, allows for the use of copper materials, and minimizes the costs of materials and production of the circuit board. The circuit board is connected via a housing with a coolant of a cryogenic device in order to provide heat extraction. The extraction of heat from the circuit board occurs by connecting the circuit board via a housing with a coolant of a cryogenic device.

    摘要翻译： 用于最大化导体轨道的载流能力和电路板上或导体内的导体的载流能力的组件和方法允许使用铜材料，并且最小化材料的成本和生产电路板 。 电路板通过壳体与低温装置的冷却剂连接，以提供热量提取。 通过将电路板通过壳体与低温装置的冷却剂连接来实现从电路板提取热量。

    VARIABLE IMPEDANCE DEVICE WITH INTEGRATED REFRIGERATION
    6.
    发明申请
    VARIABLE IMPEDANCE DEVICE WITH INTEGRATED REFRIGERATION 有权
    具有集成制冷的可变阻抗装置

    公开(公告)号：US20120229959A1

    公开(公告)日：2012-09-13

    申请号：US13418317

    申请日：2012-03-12

    申请人： Matthew J. HOLCOMB

    发明人： Matthew J. HOLCOMB

    IPC分类号： H05K7/20 ,  H01B13/00 ,  F25B9/00 ,  F25B9/02 ,  B21D53/02

    CPC分类号： H05K7/20372 ,  F25B9/02 ,  F25B9/145 ,  H01L39/16 ,  Y10T29/49002 ,  Y10T29/49359

    摘要： The invention provides a variable impedance device including a first bus bar refrigeration system, a first bus bar thermally connected to the first bus bar refrigeration system to be maintained at a target bus bar temperature by the first bus bar refrigeration system, a variable impedance component refrigeration system, a variable impedance component electrically connected to the first bus bar and thermally connected to the component refrigeration system, a variable impedance component may be at least partially made of a material that is superconducting below a critical temperature and may be maintained at a target component temperature, wherein the target bus bar temperature may be between the 300K and critical temperature and the target component temperature may be below the critical temperature and a second bus bar connected to the variable impedance component so that current flows between the first and second leads through the variable impedance component.

    摘要翻译： 本发明提供了一种可变阻抗装置，包括第一汇流条制冷系统，与第一汇流条制冷系统热连接的第一汇流条，通过第一汇流条制冷系统保持在目标母线温度，可变阻抗分量制冷 系统，电连接到第一母线并且热连接到部件制冷系统的可变阻抗部件，可变阻抗部件可以至少部分地由低于临界温度的超导材料制成，并且可以保持在目标部件 温度，其中目标母线温度可以在300K和临界温度之间，并且目标部件温度可能低于临界温度，而第二母线连接到可变阻抗部件，使得电流在第一和第二引线之间通过 可变阻抗分量。

    COOLING SYSTEM
    7.
    发明申请
    COOLING SYSTEM 有权
    冷却系统

    公开(公告)号：US20110155569A1

    公开(公告)日：2011-06-30

    申请号：US12975962

    申请日：2010-12-22

    申请人： Tetsuya ENDO ,  Einstein Noel Abarra

    发明人： Tetsuya ENDO ,  Einstein Noel Abarra

    IPC分类号： F28F13/00 ,  C23C14/34

    CPC分类号： H05K7/20009 ,  F25D25/027 ,  H01J37/34 ,  H05K7/20372 ,  H05K7/20545

    摘要： A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling stage, a wafer rotating mechanism which holds the wafer in a state separated from the wafer cooling stage by a predetermined gap, and is rotated while holding the wafer, and a driving mechanism which rotates the wafer rotating mechanism at a predetermined rotational speed.

    摘要翻译： 在溅射装置的真空室中冷却晶片的冷却系统包括用于冷却晶片的晶片冷却阶段，用于冷却晶片冷却级的冷却机构，将冷却气体引入到晶片冷却级的冷却气体供给单元 晶片旋转机构，其将晶片保持在与晶片冷却台分离预定间隙的状态，并且在保持晶片的同时旋转;以及驱动机构，其以预定旋转速度旋转晶片旋转机构。

    Methods and apparatus for cooling systems for cryogenic power conversion electronics
    8.
    发明授权
    Methods and apparatus for cooling systems for cryogenic power conversion electronics 失效
    用于低温电力转换电子设备冷却系统的方法和装置

    公开(公告)号：US6023934A

    公开(公告)日：2000-02-15

    申请号：US698806

    申请日：1996-08-16

    申请人： Calman Gold

    发明人： Calman Gold

    IPC分类号： H01L23/44 ,  H05K7/20 ,  F25B19/00

    CPC分类号： H05K7/20372 ,  H01L23/445 ,  H01L2924/0002

    摘要： Methods and apparatus for cooling systems for cryogenic power conversion electronics are provided. The invention includes systems having electronic power conversion apparatus comprising at least one cryogenically operated semiconductor switch and at least one cryogenically operated capacitor and cooling means for cryogenically cooling the at least one cryogenically operated semiconductor switch and the at least one cryogenically operated capacitor to a temperature between 90K to 236K. The systems can also include input/output means for supplying power to said power conversion apparatus and receiving power from said power conversion apparatus. In alternative embodiments, liquid cryogens can be used in heat exchange systems in conjunction with refrigeration cold heads or heat pipes. In these embodiments, the cryogen can be recondensed if boiled.

    摘要翻译： 提供了用于低温电力转换电子设备的冷却系统的方法和设备。 本发明包括具有电子功率转换装置的系统，其包括至少一个低温操作的半导体开关和至少一个低温操作的电容器和冷却装置，用于将至少一个低温操作的半导体开关和至少一个低温操作的电容器低温冷却至 90K至236K。 所述系统还可以包括用于向所述电力转换装置供电并从所述电力转换装置接收电力的输入/输出装置。 在替代实施例中，液体冷冻剂可以与制冷冷头或热管结合使用在热交换系统中。 在这些实施方案中，如果煮沸，可以重新冷凝冷冻剂。

    NON-CONTACT THERMAL RADIATION SHIELD INTERFACE
    10.
    发明公开
    NON-CONTACT THERMAL RADIATION SHIELD INTERFACE 审中-公开

    公开(公告)号：US20240098939A1

    公开(公告)日：2024-03-21

    申请号：US17934194

    申请日：2022-09-21

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Nicholas A. Masluk

    IPC分类号： H05K7/20 ,  G06N10/40

    CPC分类号： H05K7/20372 ,  G06N10/40

    摘要： A thermal radiation shield interface for cryogenic systems includes a first element with a distal, free end. Flanges project from the distal, free end of the first element. A second element also includes a distal, free end. Flanges project from the distal, free end of the second element. The flanges of the first element and the flanges of the second element are positioned in an interleaved arrangement to cover an opening between the first element and the second element shielding the opening from radiation leakage.