公开(公告)号：US20200167291A1

公开(公告)日：2020-05-28

申请号：US16200446

申请日：2018-11-26

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Anthony ASARO ,  Richard E. GEORGE

IPC: G06F12/1009 ,  G06F11/07 ,  G06F11/36 ,  G06F9/30

Abstract: For one or more stages of execution of a software application at a first processor, a remap vector of a second processor is reconfigured to represent a dynamic mapping of virtual address groups to physical address groups for that stage. Each bit position of the remap vector is configured to store a value indicating whether a corresponding virtual address group is actively mapped to a corresponding physical address group. Address translation operations issued during a stage of execution of the software application are selectively processed based on the configuration of the remap vector for that stage, with the particular value at the bit position of the remap vector associated with the corresponding virtual address group controlling whether processing of the address translation operation is continued to obtain a virtual-to-physical address translation sought by the address translation operation or processing of the address translation operation is ceased and a fault is issued.

公开(公告)号：US20250132270A1

公开(公告)日：2025-04-24

申请号：US18382973

申请日：2023-10-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Mohit ARORA ,  Deepak Vasant KULKARNI ,  Richard E. GEORGE ,  Terry Eugene RICHARDSON

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: A chip package includes a package substrate and an integrated circuit (IC) die disposed on the package substrate. The IC dies includes a security asset. The chip package also includes a glass based shield selectively disposed on the IC die and above the security asset. The glass based shield is configured to block access to the security asset. In some embodiments, the chip package includes an oxide layer disposed between the glass based shield and the IC die. In some embodiments, the chip package includes a detection module and a wire connecting the detection module to the glass based shield. The detection module is configured to generate and send a serial bit stream to the glass based shield. The detection module is also configured to monitor for changes in the serial bit stream returning from the glass based shield. Changes detected in the serial bit stream indicates the glass based shield has been tampered.