公开(公告)号：US20250076367A1

公开(公告)日：2025-03-06

申请号：US18817872

申请日：2024-08-28

Applicant: ADVANTEST Corporation

Inventor： Aritomo Kikuchi ,  Toshiyuki Kiyokawa

IPC: G01R31/28

Abstract: A semiconductor wafer handling apparatus moves a semiconductor wafer including a first surface on which a terminal of one or more device under tests (DUTs) is disposed and presses the terminal against a contactor of a probe card. The semiconductor wafer handling apparatus includes: a holder that holds the semiconductor wafer such that the first surface and a second surface of the semiconductor wafer are at least partially exposed; a first moving device that relatively moves the holder with respect to the probe card; a temperature adjusting device that contacts the second surface of the semiconductor wafer and adjusts a temperature of the DUTs; and a second moving device that relatively moves the temperature adjusting device with respect to the semiconductor wafer held by the holder.

公开(公告)号：US20250076366A1

公开(公告)日：2025-03-06

申请号：US18816814

申请日：2024-08-27

Applicant: ADVANTEST Corporation

Inventor： Aritomo Kikuchi ,  Toshiyuki Kiyokawa

IPC: G01R31/28 ,  G01R1/073

Abstract: A semiconductor wafer handling apparatus that moves a semiconductor wafer including a device under test (DUT) and presses a terminal of the DUT against a contactor of a probe card, the semiconductor wafer handling apparatus includes an optical probe that inputs and outputs an optical signal to and from an optical connection part of the DUT. The terminal is disposed on a first surface of the semiconductor wafer. The optical connection part is disposed on a second surface of the semiconductor wafer.

公开(公告)号：US20190041470A1

公开(公告)日：2019-02-07

申请号：US16043396

申请日：2018-07-24

Applicant: Advantest Corporation

Inventor： Yuki Endo ,  Aritomo Kikuchi ,  Shigeo Nakamura

IPC: G01R33/00 ,  G01R33/09

CPC classification number: G01R33/0023 ,  G01R33/09 ,  G01R33/093

Abstract: [Object] Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor.[Solving Means] A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic field to a magnetic sensor, temperature regulators 30 and 40 that regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnets 50 and 60 and the temperature regulators 30 and 40, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnets 50 and 60 while the heat is applied to the magnetic sensor by the temperature regulators 30 and 40.

公开(公告)号：US20250076374A1

公开(公告)日：2025-03-06

申请号：US18776540

申请日：2024-07-18

Applicant: ADVANTEST Corporation

Inventor： Aritomo Kikuchi ,  Hideo Hara

IPC: G01R31/311 ,  G01R31/28

Abstract: A semiconductor device handling apparatus that moves a device under test (DUT) so that a terminal on a first surface of the DUT contacts a contact part of a semiconductor device testing apparatus, the semiconductor device handling apparatus includes a holding part that holds a second surface of the DUT and an optical probe that inputs and outputs an optical signal to and from an optical connection part on the second surface of the DUT.

公开(公告)号：US20230296666A1

公开(公告)日：2023-09-21

申请号：US18163056

申请日：2023-02-01

Applicant: ADVANTEST Corporation

Inventor： Yuya Yamada ,  Aritomo Kikuchi ,  Yasuyuki Kato

IPC: G01R31/28 ,  F28F13/12

CPC classification number: G01R31/2877 ,  F28F13/125 ,  G01R31/2886

Abstract: A temperature adjusting device adjusts a temperature of a device under test (DUT) electrically connected to a socket, and includes: a fluid connector connected to a fluid supply source that supplies a fluid; a heat exchanger thermally connected to at least one of the DUT and a carrier holding the DUT in a state that the at least one of the DUT and the carrier is pressed against the socket; a first flow path passing through an inside of the heat exchanger; and a first swirl flow forming part that swirls a flow of the fluid to form a first swirl flow and supplies the first swirl flow to the first flow path, the first swirl swirling along an inner surface of the first flow path around a first central axis of the first flow path.

公开(公告)号：US11287468B2

公开(公告)日：2022-03-29

申请号：US17104749

申请日：2020-11-25

Applicant: ADVANTEST Corporation

Inventor： Natsuki Shiota ,  Aritomo Kikuchi

IPC: G01R31/28 ,  G01R29/10

Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

公开(公告)号：US20210285999A1

公开(公告)日：2021-09-16

申请号：US17186846

申请日：2021-02-26

Applicant: ADVANTEST Corporation

Inventor： Masataka Onozawa ,  Mitsunori Aizawa ,  Aritomo Kikuchi

IPC: G01R31/28

Abstract: An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: a set plate that holds a DUT container including a plurality of pockets each of which accommodates the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor.

公开(公告)号：US10823788B2

公开(公告)日：2020-11-03

申请号：US16043396

申请日：2018-07-24

Applicant: Advantest Corporation

Inventor： Yuki Endo ,  Aritomo Kikuchi ,  Shigeo Nakamura

IPC: G01N27/72 ,  G01R33/00 ,  G01R33/09 ,  G01R33/035

Abstract: Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor.A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic field to a magnetic sensor, temperature regulators 30 and 40 that regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnets 50 and 60 and the temperature regulators 30 and 40, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnets 50 and 60 while the heat is applied to the magnetic sensor by the temperature regulators 30 and 40.

公开(公告)号：US10297043B2

公开(公告)日：2019-05-21

申请号：US15481703

申请日：2017-04-07

Applicant: ADVANTEST CORPORATION

Inventor： Masataka Onozawa ,  Aritomo Kikuchi

IPC: G03F7/20 ,  G06T7/73

Abstract: An apparatus for detecting an attitude of electronic components. The electronic components include an electronic component having a plurality of terminals. The apparatus includes a storage and an image processor. The image processor is configured to: extract a binarized image from an image acquired by an imaging device; perform image matching between a terminal in the binarized image and a terminal in a model image to extract attitude candidates of image matching; obtain coordinates of a corner part of the plurality of terminals from the binarized image of the electronic component; select an attitude candidate from among the attitude candidates of image matching; and output the attitude candidate as a detected attitude of the electronic component.

公开(公告)号：US11496227B2

公开(公告)日：2022-11-08

申请号：US17107022

申请日：2020-11-30

Applicant: ADVANTEST Corporation

Inventor： Natsuki Shiota ,  Aritomo Kikuchi

IPC: H04B17/10 ,  H04B17/14 ,  H04B17/12 ,  H04B5/00

Abstract: An electronic component handling apparatus includes: a moving device that moves a device under test (DUT) including a first antenna and presses the DUT against a socket. The moving device includes a holder that holds the DUT and a second antenna that receives a radio wave radiated from the first antenna or that radiates the radio wave to the first antenna.