公开(公告)号：US20160270242A1

公开(公告)日：2016-09-15

申请号：US15036487

申请日：2014-11-14

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jong-Soo KIM ,  Jeong-Sang YU ,  O-Chung KWON ,  Sung-Baek DAN

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/28 ,  H05K1/03 ,  H05K3/06 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K3/467 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0145

Abstract: Disclosed are a flexible printed circuit board and a method of manufacturing the same, wherein a deposition seed layer is formed on a substrate, a circuit cover layer having a circuit pattern groove in the shape of a circuit pattern is formed on the deposition seed layer, the circuit pattern groove is plated with a circuit plating layer, followed by etching, thus forming a circuit pattern, thereby realizing low-resistance characteristics, reducing manufacturing costs through a simple and easy manufacturing process, and increasing productivity.

Abstract translation: 公开了柔性印刷电路板及其制造方法，其中在基板上形成沉积种子层，在沉积种子层上形成具有电路图案形状的电路图案槽的电路覆盖层， 电路图案槽镀有电路镀层，然后蚀刻，从而形成电路图案，从而实现低电阻特性，通过简单且容易的制造工艺降低制造成本，并提高生产率。