公开(公告)号：US20160270242A1

公开(公告)日：2016-09-15

申请号：US15036487

申请日：2014-11-14

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jong-Soo KIM ,  Jeong-Sang YU ,  O-Chung KWON ,  Sung-Baek DAN

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/28 ,  H05K1/03 ,  H05K3/06 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K3/467 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0145

Abstract: Disclosed are a flexible printed circuit board and a method of manufacturing the same, wherein a deposition seed layer is formed on a substrate, a circuit cover layer having a circuit pattern groove in the shape of a circuit pattern is formed on the deposition seed layer, the circuit pattern groove is plated with a circuit plating layer, followed by etching, thus forming a circuit pattern, thereby realizing low-resistance characteristics, reducing manufacturing costs through a simple and easy manufacturing process, and increasing productivity.

Abstract translation: 公开了柔性印刷电路板及其制造方法，其中在基板上形成沉积种子层，在沉积种子层上形成具有电路图案形状的电路图案槽的电路覆盖层， 电路图案槽镀有电路镀层，然后蚀刻，从而形成电路图案，从而实现低电阻特性，通过简单且容易的制造工艺降低制造成本，并提高生产率。

公开(公告)号：US20200301279A1

公开(公告)日：2020-09-24

申请号：US16646905

申请日：2018-09-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Sung-Baek DAN

IPC: G03F7/11 ,  H05K1/09 ,  H05K3/06

Abstract: Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 μm by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 μm to 5 μm.

公开(公告)号：US20200264730A1

公开(公告)日：2020-08-20

申请号：US16646924

申请日：2018-09-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Sung-Baek DAN

IPC: G06F3/044 ,  G03F7/20

Abstract: Disclosed is a method for manufacturing a substrate for a touch screen panel in which a signal line pattern having a fine line width may be formed by forming a thin film deposition in a bezel region of a transparent substrate and forming a photoresist layer on a thin film deposition layer through an electrospinning process. The disclosed method for manufacturing a substrate for a touch screen panel comprises the steps of: preparing a plate-shaped transparent substrate having a sensing region and a bezel region located on the outer periphery of the sensing region; forming a transparent electrode layer in the sensing region of the transparent substrate; forming a thin film deposition layer in the bezel region of the transparent substrate; and forming a photoresist layer on an upper surface of the thin film deposition layer through an electrospinning process.

公开(公告)号：US20210195762A1

公开(公告)日：2021-06-24

申请号：US16755556

申请日：2018-10-12

Applicant: AMOGREENTECH CO., LTD.

Inventor： Sung-Baek DAN

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42

Abstract: Disclosed are a method for fabricating a printed circuit board wherein through-holes are formed in an organic substrate, followed by forming micro-circuit patterns through sputtering and plating, whereby the printed circuit board has low permittivity properties and enables high-speed processing, and a printed circuit board fabricated thereby. The disclosed method for fabricating a printed circuit board comprises the steps of: preparing a base substrate; forming a through-hole perforating the base substrate; forming a thin seed layer on the base substrate and in the through-hole; forming a thin plate layer on the thin seed layer; and etching the thin seed layer and the thin plate layer to form a micro-circuit pattern, wherein the base substrate is one selected from an organic substrate, FR-4, and Prepreg.

公开(公告)号：US20210127501A1

公开(公告)日：2021-04-29

申请号：US16618067

申请日：2018-05-16

Applicant: AMOGREENTECH CO., LTD.

Inventor： Sung-Baek DAN

IPC: H05K3/46 ,  H05K3/28 ,  H05K3/38 ,  H05K3/00 ,  H05K1/02

Abstract: A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.