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    HEADPHONE EARTIPS WITH INTERNAL SUPPORT COMPONENTS FOR OUTER EARTIP BODIES
    1.
    发明公开
    HEADPHONE EARTIPS WITH INTERNAL SUPPORT COMPONENTS FOR OUTER EARTIP BODIES 审中-公开

    公开(公告)号：US20230239605A1

    公开(公告)日：2023-07-27

    申请号：US18127301

    申请日：2023-03-28

    Applicant: APPLE INC.

    Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

    IPC: H04R1/10

    CPC classification number: H04R1/1016 ,  H04R1/1058

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    STRUCTURALLY MOUNTABLE BATTERY
    2.
    发明申请
    STRUCTURALLY MOUNTABLE BATTERY 有权

    公开(公告)号：US20230102315A1

    公开(公告)日：2023-03-30

    申请号：US17838779

    申请日：2022-06-13

    Applicant: Apple Inc.

    Inventor： Michael P. Zhang ,  Hirotsugu Oba ,  Tyler S. Atura Bushnell ,  Brad G. Boozer ,  Woojin Jung

    IPC: H01M50/262 ,  H02J7/00 ,  H01M50/204 ,  H01M50/231 ,  H01M50/224 ,  H01M50/247 ,  H01M10/0525

    Abstract: The disclosed technology relates to a battery pack configured to be structurally mounted to a portable electronic device. The battery pack comprises a plurality of layers and an enclosure. The enclosure comprises a first surface and a plurality of walls that extend from the first surface in a direction perpendicular to the first surface. A portion of the first surface extends past at least one wall of the plurality of walls. The enclosure comprises a second surface configured to be connected to the plurality of walls to form a body configured to enclose the plurality of layers. The portion of the first surface is configured to be coupled to a device and the battery pack is configured to provide at least one component of the device with power when the portion of the first surface is coupled to the device.

    Electronic Devices Having Circuitry in Housing Attachment Structures
    3.
    发明申请
    Electronic Devices Having Circuitry in Housing Attachment Structures 有权

    公开(公告)号：US20210273671A1

    公开(公告)日：2021-09-02

    申请号：US17326214

    申请日：2021-05-20

    Applicant: Apple Inc.

    Inventor： James G. Horiuchi ,  Tyler S. Bushnell ,  Brad G. Boozer ,  Mario Martinis ,  YoungHoon Kim

    IPC: H04B1/3827 ,  H01Q1/24 ,  G06F3/044 ,  H01Q1/27

    Abstract: An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.

    Electronic Devices Having Circuitry in Housing Attachment Structures
    5.
    发明申请
    Electronic Devices Having Circuitry in Housing Attachment Structures 审中-公开

    公开(公告)号：US20200186179A1

    公开(公告)日：2020-06-11

    申请号：US16589643

    申请日：2019-10-01

    Applicant: Apple Inc.

    Inventor： James G. Horiuchi ,  Tyler S. Bushnell ,  Brad G. Boozer ,  Mario Martinis ,  YoungHoon Kim

    IPC: H04B1/3827 ,  H01Q1/24 ,  H01Q1/27 ,  G06F3/044

    Abstract: An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.

    Electronic device with encapsulated circuit assembly having an integrated metal layer
    8.
    发明授权
    Electronic device with encapsulated circuit assembly having an integrated metal layer 有权

    公开(公告)号：US10327326B2

    公开(公告)日：2019-06-18

    申请号：US15819243

    申请日：2017-11-21

    Applicant: Apple Inc.

    Inventor： Brad G. Boozer ,  Colin M. Ely ,  Steven P. Cardinali

    IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H03K17/96 ,  H05K5/00 ,  H05K3/28 ,  H05K5/06 ,  H05K9/00

    Abstract: Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.

    Electronic device with speaker cavity cooling
    9.
    发明授权
    Electronic device with speaker cavity cooling 有权

    公开(公告)号：US09860660B1

    公开(公告)日：2018-01-02

    申请号：US14720572

    申请日：2015-05-22

    Applicant: Apple Inc.

    Inventor： Nathan P. Bosscher ,  Brad G. Boozer ,  Craig M. Stanley ,  Jeffrey C. Olson ,  John J. Baker ,  Phillip Michael Hobson ,  Stephen Brian Lynch

    IPC: H04R29/00 ,  H04R1/00

    CPC classification number: H04R3/007 ,  H04R1/028 ,  H04R9/022

    Abstract: An electronic device may have a housing. The housing may enclose an interior cavity. A speaker may be mounted in an opening in the housing. The interior cavity may serve as a sealed back volume for the speaker during normal operation of the speaker. During normal operation, control circuitry in the interior cavity plays audio content through the speaker. When it is desired to cool the control circuitry and the speaker, the control circuitry supplies a subaudible signal to the speaker. Airflow regulators having one-way valves and valves that are controlled by the control circuitry are mounted in the housing. Movement of a diaphragm in the speaker when the subaudible speaker is applied causes the diaphragm to pump air through the airflow regulators, creating a cooling airflow through the interior cavity.

    PRINTED CIRCUIT BOARD CONNECTOR FOR NON-PLANAR CONFIGURATIONS
    10.
    发明申请
    PRINTED CIRCUIT BOARD CONNECTOR FOR NON-PLANAR CONFIGURATIONS 有权
    用于非平面配置的印刷电路板连接器

    公开(公告)号：US20160028173A1

    公开(公告)日：2016-01-28

    申请号：US14444424

    申请日：2014-07-28

    Applicant: Apple Inc.

    Inventor： Nathan P. Bosscher ,  Craig M. Stanley ,  Trent K. Do ,  John J. Baker ,  Phillip M. Hobson ,  Brad G. Boozer

    IPC: H01R12/73 ,  H05K3/36 ,  H01R12/72

    CPC classification number: H01R12/732 ,  H01R12/722 ,  H01R35/04 ,  H05K1/038 ,  H05K1/14 ,  H05K1/148 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/10189

    Abstract: A mesh network of printed circuit boards (PCBs) including a first PCB coupled to a second rigid PCB by way of an interlocking connection is provided. The interlocking connection has a degree of freedom that allows the first and second PCBs to form a twist angle between each other; the interlocking connector configured to provide electrical coupling between active components disposed in each of the first and second PCBs. A method of forming a substrate fabric including a mesh network as above is also provided. Further provided is a method of activating the mesh network of printed circuit boards as above.

    Abstract translation: 提供了包括通过互锁连接耦合到第二刚性PCB的第一PCB的印刷电路板（PCB）的网状网络。 互锁连接具有允许第一和第二PCB彼此之间形成扭转角度的自由度; 所述互锁连接器被配置为在布置在所述第一和第二PCB中的每一个中的有源部件之间提供电耦合。 还提供了如上所述形成包括网状网络的基底织物的方法。 还提供如上所述的激活印刷电路板的网状网络的方法。

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