HEAT DISSIPATION CASE AND METHODS FOR NAVIGATING HEAT FROM AN ELECTRONIC DEVICE
    2.
    发明申请
    HEAT DISSIPATION CASE AND METHODS FOR NAVIGATING HEAT FROM AN ELECTRONIC DEVICE 审中-公开
    用于从电子设备导入热量的散热情况和方法

    公开(公告)号:US20170064869A1

    公开(公告)日:2017-03-02

    申请号:US14836894

    申请日:2015-08-26

    Applicant: Apple Inc.

    Abstract: An accessory device suitable for use with an electronic device is disclosed. The accessory device may be designed to provide a protective cover and dissipate heat from the device. Regarding the latter, the accessory device may include a thermally conductive layer disposed in the accessory device. The thermally conductive layer may extend from a first end of the accessory device proximate to a heat-generating component in the electronic device, to a second end away from the heat-generating component. The thermally conductive layer is designed to navigate heat away from the heat-generating component to the second end where the heat escapes the accessory device. The second end may include one or more openings to facilitate heat transfer from the accessory device. In other embodiments, the accessory device includes a phase change material that absorbs heat and changes to a liquid, then passes the heat to another location in the accessory device.

    Abstract translation: 公开了一种适用于电子设备的配件。 附件装置可以设计成提供保护盖并从装置散发热量。 关于后者,附件装置可以包括设置在附件装置中的导热层。 导热层可以从附件装置的第一端附近靠近电子装置中的发热部件延伸到远离发热部件的第二端。 导热层被设计成将热量从发热部件导向热量逸出附件装置的第二端。 第二端可以包括一个或多个开口以便于从附件装置传热。 在其他实施例中,附件装置包括相变材料,其吸收热量和变化液体,然后将热量传递到附件装置中的另一位置。

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