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公开(公告)号：US20200281097A1
公开(公告)日：2020-09-03
申请号：US16875799
申请日：2020-05-15
Applicant: Apple Inc.
Inventor： David A. PAKULA , Daniel W. JARVIS , Gregory N. STEPHENS , Ian A. SPRAGGS , James A. BERTIN , Eric M. BENNETT , Simon C. HELMORE , Melissa A. WAH , Matthew D. HILL , Jon F. HOUSOUR , Douglas G. FOURNIER , Christopher S. TOMASETTA
Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
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公开(公告)号：US20180083322A1
公开(公告)日：2018-03-22
申请号：US15712068
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： David A. PAKULA , Daniel W. JARVIS , Gregory N. STEPHENS , Ian A. SPRAGGS , James A. BERTIN , Eric M. BENNETT , Simon C. HELMORE , Melissa A. WAH , Matthew D. HILL , Jon F. HOUSOUR , Douglas G. FOURNIER , Christopher S. TOMASETTA
Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
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公开(公告)号：US20170013738A1
公开(公告)日：2017-01-12
申请号：US15273574
申请日：2016-09-22
Applicant: Apple Inc.
Inventor： Daniel W. JARVIS , Benjamin J. POPE , Jason SLOEY , Jonathan C. DENBY , Ian A. SPRAGGS , Shayan MALEK
CPC classification number: H05K7/14 , H01H23/04 , H01H23/148 , H01R43/205 , H04M1/026 , H04M1/0274 , H04M1/0277 , H05K7/026 , H05K7/06
Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，许多插入模制的保持构件用于在跌落事件期间抑制壳体的侧壁的向外变形。 在另一个实施例中，利用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。
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公开(公告)号：US20180084680A1
公开(公告)日：2018-03-22
申请号：US15712069
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： Daniel W. JARVIS , David A. PAKULA , David J. DUNSMOOR , Ian A. SPRAGGS , Lee E. HOOTON , Marwan RAMMAH , Matthew D. HILL , Robert F. MEYER , James A. BERTIN , Eric M. BENNETT , Simon C. HELMORE , Melissa A. WAH , Jon F. HOUSOUR , Douglas G. FOURNIER , Christopher S. TOMASETTA
IPC: H05K7/20
CPC classification number: H05K7/20481 , B32B2307/302 , B32B2457/20 , G06F1/1637 , G06F1/1643 , G06F3/0412 , G06F3/0414 , G06F3/044 , G06F2203/04112 , H01M2/08 , H01M2/1016 , H01M2/1022 , H01M2220/30 , H02J7/0042 , H05K1/0216 , H05K1/144 , H05K7/20963
Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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公开(公告)号：US20170068292A1
公开(公告)日：2017-03-09
申请号：US15146825
申请日：2016-05-04
Applicant: Apple Inc.
Inventor： Lee E. HOOTON , Ian A. SPRAGGS , Marwan RAMMAH , Seth REIGHTLER , Tyler KAKUDA
CPC classification number: G06F1/203 , G06F1/1626 , G06F1/1637
Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.
Abstract translation: 本申请涉及使用能耗散和引导热能的各种特征的计算装置的热管理。 在一些实施例中，设置热插入件用于将组件与计算设备的盖玻片分离。 热插入件可以通过将热插入件嵌入到框架中而附接到计算设备的框架。 在其他实施例中，可以在计算设备内的不同表面上布置石墨条，以便将热能引导到计算设备的部件。 在其它实施例中，散热器和导热粘合剂可以设置在计算设备的不同表面上。 例如，散热器和导热粘合剂可用于将热能引导离开计算设备的背光源。
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Patent Agency Ranking
公开(公告)号：US20200310489A1
公开(公告)日：2020-10-01
申请号：US16586726
申请日：2019-09-27
Applicant: Apple Inc.
Inventor： Ian A. SPRAGGS , Stoyan P. HRISTOV , Daniel W. JARVIS , Jason B. NEEVEL , Nicholas G. MERZ , Garrett R. OWOC , David A. PAKULA
IPC: G06F1/16
Abstract: According to some embodiments, a portable electronic device is described. The portable electronic device includes a housing having side walls and a back wall that define a cavity, where the back wall includes (i) a first section having a first exterior surface, and (ii) a second section having a second exterior surface that is parallel to and vertically displaced from the first exterior surface. The portable electronic device further includes a brace structure joined to the back wall, a trim structure welded to the brace structure, where the trim structure has an external surface that is vertically displaced from the second exterior surface, and a camera module disposed within the cavity and carried by the brace structure.
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公开(公告)号：US20180084636A1
公开(公告)日：2018-03-22
申请号：US15712071
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： David A. PAKULA , Daniel W. JARVIS , Gregory N. STEPHENS , Ian A. SPRAGGS , Vu Thanh VO , Amir SALEHI , Dennis R. PYPER , Alex J. CRUMLIN , Corey S. PROVENCHER , Derek J. WALTERS , Michael V. YEH
CPC classification number: H05K7/20481 , B32B2307/302 , B32B2457/20 , G06F1/1637 , G06F1/1643 , G06F3/0412 , G06F3/0414 , G06F3/044 , G06F2203/04112 , H01M2/08 , H01M2/1016 , H01M2/1022 , H01M2220/30 , H02J7/0042 , H05K1/0216 , H05K1/144 , H05K1/148 , H05K7/20963 , H05K9/0033 , H05K2201/042 , H05K2201/10242 , H05K2201/10257
Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
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公开(公告)号：US20170071064A1
公开(公告)日：2017-03-09
申请号：US15260222
申请日：2016-09-08
Applicant: Apple Inc.
Inventor： Lee E. HOOTON , Daniel W. JARVIS , Marwan RAMMAH , Ian A. SPRAGGS , Nicholas G. MERZ
CPC classification number: H04M1/0266 , G06F1/1613 , G06F1/1626 , G06F1/1637 , H04M1/0249
Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.
Abstract translation: 公开了一种具有用框架固定的盖玻璃的电子设备。 电子设备包括位于盖玻璃和框架之间的掩模层。 掩模层可以包括几个油墨层。 可以改变一个油墨层的颜料组合物，以便改善油墨层和盖玻璃之间的粘结。 可以修改框架以增强掩模层和框架之间的粘结。 例如，可以改变框架以包括多孔区域以增加框架的表面积，使得粘合剂可以结合到附加表面区域。 框架还可以包括可以增加接收粘合剂的框架的表面积的延伸部或肋。 框架可以包括有助于嵌入成型特征之间的组装的开口或空腔。
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公开(公告)号：US20210232180A1
公开(公告)日：2021-07-29
申请号：US17220592
申请日：2021-04-01
Applicant: Apple Inc.
Inventor： David A. PAKULA , Daniel W. JARVIS , Shimon ELKAYAM , Brandon R. GARBUS , Christopher S. GRAHAM , Karl Ruben F. LARSSON , Ashley E. FLETCHER , Jared M. KOLE , Eric S. JOL , Aaron A. ORO , Michael D. QUINONES , Gregory N. STEPHENS , Ian A. SPRAGGS , James A. BERTIN , Simon C. HELMORE , Melissa A. WAH , Matthew D. HILL , Jon F. HOUSOUR , Douglas G. FOURNIER , Christopher S. TOMASETTA
Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.
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公开(公告)号：US20210072801A1
公开(公告)日：2021-03-11
申请号：US16818680
申请日：2020-03-13
Applicant: Apple Inc.
Inventor： Andrew U. LEOPOLD , Owen D. HALE , Daniel W. JARVIS , David A. PAKULA , James B. SMITH , Ian A. SPRAGGS , Gregory N. STEPHENS
IPC: G06F1/16 , H05K7/02 , H01R12/52 , H05K9/00 , H05K1/18 , H02J50/10 , H02J7/02 , H04R1/02 , H04R3/00
Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.
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