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    PRINTABLE RING ADHESIVES FOR USE IN THE MANUFACTURE OF PORTABLE ELECTRONIC DEVICES
    5.
    发明申请
    PRINTABLE RING ADHESIVES FOR USE IN THE MANUFACTURE OF PORTABLE ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20200079127A1

    公开(公告)日：2020-03-12

    申请号：US16125381

    申请日：2018-09-07

    Applicant: Apple Inc.

    Inventor： Lee E. HOOTON ,  Ashley E. FLETCHER ,  Daniel W. JARVIS ,  Marwan RAMMAH ,  Richard Hung Minh DINH

    IPC: B41M3/00 ,  B41M1/30 ,  G06F1/16

    Abstract: This application relates to ring-shaped adhesives for use during the manufacturing of a portable electronic device. The portable electronic device can have a small form factor, such as being a tablet computer or a mobile phone. A printable adhesive is dispensed on a release liner in a shape that conforms with a surface of the portable electronic device. The shape of the printable adhesive follows a path characterized by a continuous closed curve and encloses an area on the release liner without printable adhesive dispensed therein. The width of the printable adhesive along the continuous closed curve can vary to conform to features in one or more surfaces of the portable electronic device. The features can have dimensions of less than one millimeter. The printable adhesive can be can be applied to the release liner by a screen printing process or by dispensing the printable adhesive through a nozzle.

    THERMALLY CONDUCTIVE STRUCTURE FOR DISSIPATING HEAT IN A PORTABLE ELECTRONIC DEVICE
    6.
    发明申请
    THERMALLY CONDUCTIVE STRUCTURE FOR DISSIPATING HEAT IN A PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20190082555A1

    公开(公告)日：2019-03-14

    申请号：US16127043

    申请日：2018-09-10

    Applicant: Apple Inc.

    Inventor： Lee E. HOOTON ,  Marwan RAMMAH ,  James A. BERTIN ,  Stoyan P. HRISTOV ,  William A. COUNTS

    IPC: H05K7/20 ,  H05K5/00 ,  H05K5/02 ,  F28F21/08

    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

    THERMAL FEATURES OF A MOBILE DEVICE
    8.
    发明申请
    THERMAL FEATURES OF A MOBILE DEVICE 审中-公开
    移动设备的热特性

    公开(公告)号：US20170068292A1

    公开(公告)日：2017-03-09

    申请号：US15146825

    申请日：2016-05-04

    Applicant: Apple Inc.

    Inventor： Lee E. HOOTON ,  Ian A. SPRAGGS ,  Marwan RAMMAH ,  Seth REIGHTLER ,  Tyler KAKUDA

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1637

    Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.

    Abstract translation: 本申请涉及使用能耗散和引导热能的各种特征的计算装置的热管理。 在一些实施例中，设置热插入件用于将组件与计算设备的盖玻片分离。 热插入件可以通过将热插入件嵌入到框架中而附接到计算设备的框架。 在其他实施例中，可以在计算设备内的不同表面上布置石墨条，以便将热能引导到计算设备的部件。 在其它实施例中，散热器和导热粘合剂可以设置在计算设备的不同表面上。 例如，散热器和导热粘合剂可用于将热能引导离开计算设备的背光源。

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