公开(公告)号：US20240068086A1

公开(公告)日：2024-02-29

申请号：US18074363

申请日：2022-12-02

Applicant: Applied Materials, Inc.

Inventor： Sundarapandian Ramalinga Vijayalakshmi REDDY ,  Kirankumar Neelasandra SAVANDAIAH ,  Junqi WEI ,  Bridger Earl HOERNER ,  Kelvin Tai Ming BOH ,  Madan Kumar SHIMOGA MYLARAPPA

IPC: C23C14/34

CPC classification number: C23C14/3414

Abstract: Target assemblies for PVD chambers are provided herein. In some embodiments, a target assembly for a PVD chamber includes: a backing plate; and a target coupled to the backing plate and having a substrate facing surface opposite the backing plate, wherein a peripheral portion of the target includes an angled surface extending radially outward and toward the backing plate, wherein an annular portion of the angled surface has a surface roughness greater than a surface roughness of a remainder of the substrate facing surface of the target.

公开(公告)号：US20210335582A1

公开(公告)日：2021-10-28

申请号：US16857828

申请日：2020-04-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Yueh Sheng OW ,  Yuichi WADA ,  Junqi WEI ,  Kang ZHANG ,  Ananthkrishna JUPUDI ,  Sarath BABU ,  Kok Seong TEO ,  Kok Wei TAN

IPC: H01J37/32 ,  H01L21/67

Abstract: Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.

公开(公告)号：US20240395514A1

公开(公告)日：2024-11-28

申请号：US18202335

申请日：2023-05-26

Applicant: Applied Materials, Inc.

Inventor： Prashant AGARWAL ,  Junqi WEI ,  Ananthkrishna JUPUDI ,  Clinton GOH ,  Tuck Foong KOH ,  Kai Liang LIEW

IPC: H01J37/32 ,  C23C14/02 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/58 ,  H01L21/324 ,  H01L21/67 ,  H05B6/80

Abstract: Embodiments of multi-chamber processing tools are provided herein. In some embodiments, a multi-chamber processing tool includes: a factory interface configured to receive a substrate; a pre-heat chamber directly coupled to the factory interface; a load lock chamber coupled to the factory interface and having a first slit valve disposed therebetween, wherein the load lock chamber is coupled to a pump configured to create a vacuum environment when the first slit valve is in a closed position; a degas chamber coupled to the factory interface and having a second slit valve, wherein the degas chamber is coupled to a second pump configured to create a vacuum environment when the second slit valve is in a closed position, and wherein the degas chamber includes a heat source; one or more process chambers; and a transfer chamber coupled to the load lock chamber, the degas chamber, and the one or more process chambers.

公开(公告)号：US20210335581A1

公开(公告)日：2021-10-28

申请号：US16855559

申请日：2020-04-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Sarath BABU ,  Ananthkrishna JUPUDI ,  Yueh Sheng OW ,  Junqi WEI ,  Kelvin Tai Ming BOH ,  Kang ZHANG ,  Yuichi WADA

IPC: H01J37/32

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.