公开(公告)号：US20210335581A1

公开(公告)日：2021-10-28

申请号：US16855559

申请日：2020-04-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Sarath BABU ,  Ananthkrishna JUPUDI ,  Yueh Sheng OW ,  Junqi WEI ,  Kelvin Tai Ming BOH ,  Kang ZHANG ,  Yuichi WADA

IPC: H01J37/32

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.

公开(公告)号：US20240258076A1

公开(公告)日：2024-08-01

申请号：US18103192

申请日：2023-01-30

Applicant: Applied Materials, Inc.

Inventor： Tuck Foong KOH ,  Sarath BABU ,  Yuichi WADA

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32477 ,  H01J37/32715 ,  H01L21/6833 ,  H01J2237/0206 ,  H01J2237/2007

Abstract: Embodiments of the disclosure include a substrate support including a metal body with a substrate face, a plurality of lift pin holes formed in the body, and a dielectric coating disposed on the substrate face of the body. Each of the plurality lift pin holes includes a through hole and a chamfer face configured to mate with a lift pin sleeve. The dielectric coating includes a substrate supporting surface, a thickness, and a pattern disposed in the substrate supporting surface.

公开(公告)号：US20210335582A1

公开(公告)日：2021-10-28

申请号：US16857828

申请日：2020-04-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Yueh Sheng OW ,  Yuichi WADA ,  Junqi WEI ,  Kang ZHANG ,  Ananthkrishna JUPUDI ,  Sarath BABU ,  Kok Seong TEO ,  Kok Wei TAN

IPC: H01J37/32 ,  H01L21/67

Abstract: Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.

公开(公告)号：US20250015733A1

公开(公告)日：2025-01-09

申请号：US18218794

申请日：2023-07-06

Applicant: Applied Materials, Inc.

Inventor： Mukund SUNDARARAJAN ,  Sarath BABU ,  Cheng-Hsiung Matthew TSAI ,  Ananthkrishna JUPUDI ,  Ross MARSHALL

IPC: H02N13/00 ,  B23Q3/15 ,  B23Q11/12

Abstract: Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck, includes: the electrostatic chuck; and a plurality of electrodes disposed in the electrostatic chuck, wherein the plurality of electrodes include a positive electrode arranged in a first pattern comprising a plurality of first arcuate bands coupled together via first connection fingers that extend radially therebetween and a negative electrode arranged in a second pattern comprising a plurality of second arcuate bands coupled together via second connection fingers that extend radially therebetween, wherein the plurality of first arcuate bands are arranged in an alternating pattern with the plurality of second arcuate bands, wherein there is a gap between the first pattern and the second pattern.

公开(公告)号：US20240266200A1

公开(公告)日：2024-08-08

申请号：US18107157

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Sarath BABU ,  Mukund SUNDARARAJAN ,  Cheng-Hsiung TSAI ,  Ananthkrishna JUPUDI ,  Ross MARSHALL

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103

Abstract: An electrostatic chuck assembly including a body including a body recess and a heat transfer plate disposed in the body recess, wherein the heat transfer plate includes an upper surface, a lower surface, a first opening, and a second opening. The electrostatic chuck assembly further includes an RF transmission tube configured to transfer RF power to the lower surface of the heat transfer plate. The electrostatic chuck assembly further includes a puck bonded to the upper surface of the heat transfer plate. The electrostatic chuck assembly further includes a first chucking electrode disposed in the first opening and a second chucking electrode is disposed in the second opening, wherein the first and second chucking electrodes are configured to transfer a chucking voltage to the puck.