公开(公告)号：US20210383529A1

公开(公告)日：2021-12-09

申请号：US17281948

申请日：2019-10-31

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Roman KRIS ,  Roi MEIR ,  Sahar LEVIN ,  Ishai SCHWARZBAND ,  Grigory KLEBANOV ,  Shimon LEVI ,  Efrat NOIFELD ,  Hiroshi MIROKU ,  Taku YOSHIZAWA ,  Kasturi SAHA ,  Sharon DUVDEVANI-BAR ,  Vadim VERESCHAGIN

IPC: G06T7/00 ,  G06K9/46 ,  G06K9/00 ,  G06T7/60 ,  G06T7/13 ,  G06T7/194 ,  G01N23/225

Abstract: A method for process control of a semiconductor structure fabricated by a series of fabrication steps, the method comprising obtaining an image of the semiconductor structure indicative of at least two individual fabrication steps; wherein the image is generated by scanning the semiconductor structure with a charged particle beam and collecting signals emanating from the semiconductor structure; and processing, by a hardware processor, the image to determining a parameter of the semiconductor structure, wherein processing includes measuring step/s from among the fabrication steps as an individual feature.

公开(公告)号：US20220207681A1

公开(公告)日：2022-06-30

申请号：US17135939

申请日：2020-12-28

Applicant: Applied Materials Israel Ltd.

Inventor： Roman KRIS ,  Grigory KLEBANOV ,  Einat FRISHMAN ,  Tal ORENSTEIN ,  Meir VENGROVER ,  Noa MAROM ,  Ilan BEN-HARUSH ,  Rafael BISTRITZER ,  Sharon DUVDEVANI-BAR

IPC: G06T7/00 ,  G01N21/95 ,  G03F7/20

Abstract: There is provided a system and method of generating a metrology recipe usable for examining a semiconductor specimen, comprising: obtaining a first image set comprising a plurality of first images captured by an examination tool, obtaining a second image set comprising a plurality of second images, wherein each second image is simulated based on at least one first image, wherein each second image is associated with ground truth data; performing a first test on the first image set and a second test on the second image set in accordance with a metrology recipe configured with a first parameter set, and determining, in response to a predetermined criterion not being met, to select a second parameter set, configure the metrology recipe with the second parameter set, and repeat the first test and the second test in accordance with the metrology recipe configured with the second parameter set.