中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.025 seconds)

    METHOD FOR MONITORING NANOMETRIC STRUCTURES
    1.
    发明申请
    METHOD FOR MONITORING NANOMETRIC STRUCTURES 审中-公开

    公开(公告)号：US20190219390A1

    公开(公告)日：2019-07-18

    申请号：US15870622

    申请日：2018-01-12

    Applicant: Applied Materials Israel, Ltd.

    Inventor： Shimon LEVI ,  Ishai SCHWARZBAND ,  Roman KRIS

    IPC: G01B15/08 ,  B82Y35/00

    Abstract: A method for monitoring a first nanometric structure formed by a multiple patterning process, the method may include performing a first plurality of measurements to provide a first plurality of measurement results; wherein the performing of the first plurality of measurements comprises illuminating first plurality of locations of a first sidewall of the first nanometric structure by oblique charged particle beams of different tilt angles; and processing, by a hardware processor, the first plurality of measurement results to determine a first attribute of the first nanometric structure.

    REGISTRATION OF CAD DATA WITH SEM IMAGES
    2.
    发明申请
    REGISTRATION OF CAD DATA WITH SEM IMAGES 有权
    使用SEM图像注册CAD数据

    公开(公告)号：US20160035076A1

    公开(公告)日：2016-02-04

    申请号：US14446295

    申请日：2014-07-29

    Applicant: Applied Materials Israel Ltd.

    Inventor： Ishai SCHWARZBAND ,  Yan IVANCHENKO ,  Daniel RAVID ,  Orly ZVITIA ,  Idan KAIZERMAN

    IPC: G06T7/00 ,  G06K9/62

    CPC classification number: G06T7/001 ,  G06K9/4604 ,  G06K9/6211 ,  G06K2209/19 ,  G06K2209/403 ,  G06T2207/10028 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: A method for image processing includes providing a microscopic image of a structure fabricated on a substrate and computer-aided design (CAD) data used in fabricating the structure. The microscopic image is processed by a computer so as to generate a first directionality map, which includes, for a matrix of points in the microscopic image, respective directionality vectors corresponding to magnitudes and directions of edges at the points irrespective of a sign of the magnitudes. The CAD data are processed by the computer so as to produce a simulated image based on the CAD data and to generate a second directionality map based on the simulated image. The first and second directionality maps are compared by the computer so as to register the microscopic image with the CAD data.

    Abstract translation: 一种用于图像处理的方法包括提供在基板上制造的结构的微观图像和用于制造该结构的计算机辅助设计（CAD）数据。 显微镜图像由计算机处理，以便产生第一方向性图，其包括对于微观图像中的点的矩阵，对应于点处的边缘的大小和方向的各个方向性矢量，而不管幅度的符号 。 CAD数据由计算机处理，以便根据CAD数据产生模拟图像，并且基于模拟图像产生第二方向性图。 通过计算机比较第一和第二方向性图，以便将CAD数据注册到微观图像。

    TECHNIQUE FOR MEASURING OVERLAY BETWEEN LAYERS OF A MULTILAYER STRUCTURE
    5.
    发明申请
    TECHNIQUE FOR MEASURING OVERLAY BETWEEN LAYERS OF A MULTILAYER STRUCTURE 有权
    用于测量多层结构层之间的覆盖的技术

    公开(公告)号：US20170018066A1

    公开(公告)日：2017-01-19

    申请号：US14798283

    申请日：2015-07-13

    Applicant: Applied Materials Israel Ltd.

    Inventor： Yakov WEINBERG ,  Ishai SCHWARZBAND ,  Roman KRIS ,  Itay ZAUER ,  Ran GOLDMAN ,  Olga NOVAK ,  Dhananjay Singh RATHORE ,  Ofer ADAN ,  Shimon LEVI

    IPC: G06T7/00

    CPC classification number: G06T7/0006 ,  G06K9/525 ,  G06T7/001 ,  G06T7/10 ,  G06T7/11 ,  G06T7/12 ,  G06T7/143 ,  G06T7/194 ,  G06T7/30 ,  G06T7/337 ,  G06T2207/10061 ,  G06T2207/20116 ,  G06T2207/30148

    Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

    Abstract translation: 用于确定多层结构的层之间的重叠的方法可以包括获得表示多层结构的给定图像，获得多层结构层的预期图像，提供多层结构的组合预期图像作为所述多层结构的预期图像的组合 执行给定图像对组合预期图像的注册，以及提供给定图像的分割，从而产生分割图像，以及所述多层结构层的映射。 该方法还可以包括通过将所选择的两个层的图与所述两个所选择的层的预期图像一起处理来确定多层结构的任何两个所选择的层之间的覆盖。

    MEASURING HEIGHT DIFFERENCE IN PATTERNS ON SEMICONDUCTOR WAFERS
    8.
    发明申请
    MEASURING HEIGHT DIFFERENCE IN PATTERNS ON SEMICONDUCTOR WAFERS 审中-公开

    公开(公告)号：US20180336675A1

    公开(公告)日：2018-11-22

    申请号：US15982918

    申请日：2018-05-17

    Applicant: Applied Materials Israel Ltd.

    Inventor： Ishai SCHWARZBAND ,  Yan AVNIEL ,  Sergey KHRISTO ,  Mor BARAM ,  Shimon LEVI ,  Doron GIRMONSKY ,  Roman KRIS

    IPC: G06T7/00

    Abstract: An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a function of a change in depth of shadow (i.e. relative brightness), wherein the depth of shadow depends on the height difference as well as width difference between two features on a semiconductor wafer. In another version of the model, the measurable variable is expressed in terms of a function of a change of a measured distance between two characteristic points on the real image of a periodic structure with respect to a change in a tilt angle of a scanning electron beam.

    TECHNIQUE FOR INSPECTING SEMICONDUCTOR WAFERS
    9.
    发明申请
    TECHNIQUE FOR INSPECTING SEMICONDUCTOR WAFERS 审中-公开

    公开(公告)号：US20180336671A1

    公开(公告)日：2018-11-22

    申请号：US15982876

    申请日：2018-05-17

    Applicant: Applied Materials Israel Ltd.

    Inventor： Ishai SCHWARZBAND ,  Sergey KHRISTO ,  Yan AVNIEL

    IPC: G06T7/00 ,  G06T7/564

    Abstract: A height of a pattern on a semiconductor wafer is determined by comparing a measured image of the pattern with a predicted image of the pattern, as produced by a shadow model. An estimated height of the pattern is provided as an input to the shadow model. The shadow model produces occluding contours that are used to generate predicted images. A set of predicted images are generated, each predicted image being associated with an estimated height. The estimated height corresponding to the predicted image most closely matching with the measured image is used as the height calculated by the shadow model.

Patent Agency Ranking