SEMICONDUCTOR DEPOSITION REACTOR AND COMPONENTS FOR REDUCED QUARTZ DEVITRIFICATION

    公开(公告)号:US20230002895A1

    公开(公告)日:2023-01-05

    申请号:US17810094

    申请日:2022-06-30

    Abstract: Systems of reducing devitrification within a chemical vapor deposition system can include a susceptor support ring that is configured to be positioned between a gas inlet and a gas outlet of a chamber passage. An example system can also include a getter support comprising a support base and one or more recesses therein. Each of the one or more recesses can be arranged to receive corresponding one or more support elements that are configured to support the getter plate. At least a portion of the getter support may include a coating comprising silicon carbide (SiC) having a thickness of at least about 50 microns. The getter support may be arranged to be disposed a maximum distance of between about 1 mm and about 10 mm from the susceptor support ring.

    Substrate handling device with adjustable joints

    公开(公告)号:US11488854B2

    公开(公告)日:2022-11-01

    申请号:US17189787

    申请日:2021-03-02

    Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

    SUBSTRATE HANDLING DEVICE WITH ADJUSTABLE JOINTS

    公开(公告)号:US20210287928A1

    公开(公告)日:2021-09-16

    申请号:US17189787

    申请日:2021-03-02

    Abstract: The present disclosure is directed to an adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

    Substrate handling device with adjustable joints

    公开(公告)号:US11837494B2

    公开(公告)日:2023-12-05

    申请号:US17961882

    申请日:2022-10-07

    CPC classification number: H01L21/68707 B65G47/90

    Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

    SUBSTRATE HANDLING DEVICE WITH ADJUSTABLE JOINTS

    公开(公告)号:US20230034114A1

    公开(公告)日:2023-02-02

    申请号:US17961882

    申请日:2022-10-07

    Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

    WAFER FAR EDGE TEMPERATURE MEASUREMENT SYSTEM WITH LAMP BANK ALIGNMENT

    公开(公告)号:US20220301906A1

    公开(公告)日:2022-09-22

    申请号:US17697164

    申请日:2022-03-17

    Abstract: A reactor system designed to provide accurate monitoring of wafer temperatures during deposition steps. The reactor system includes a pyrometer mounting assembly supporting and positioning three or more pyrometers (e.g., infrared (IR) pyrometers) relative to the reaction chamber to measure a center wafer temperature and an edge wafer temperature as well as reaction chamber temperature. The pyrometer mounting assembly provides a small spot size or temperature sensing area with the edge pyrometer to accurately measure edge wafer temperatures. A jig assembly, and installation method for each tool setup, is provided for use in achieving accurate alignment of the IR pyrometer sensing spot (and the edge pyrometer) relative to the wafer, when the pyrometer mounting assembly is mounted upon a lamp bank in the reactor system or in tool setup. The wafer edge temperature sensing with the reactor system assembled with proper alignment ensures accurate and repeatable measurement of wafer temperatures.

    Semiconductor deposition reactor and components for reduced quartz devitrification

    公开(公告)号:US12234554B2

    公开(公告)日:2025-02-25

    申请号:US17810094

    申请日:2022-06-30

    Abstract: Systems of reducing devitrification within a chemical vapor deposition system can include a susceptor support ring that is configured to be positioned between a gas inlet and a gas outlet of a chamber passage. An example system can also include a getter support comprising a support base and one or more recesses therein. Each of the one or more recesses can be arranged to receive corresponding one or more support elements that are configured to support the getter plate. At least a portion of the getter support may include a coating comprising silicon carbide (SiC) having a thickness of at least about 50 microns. The getter support may be arranged to be disposed a maximum distance of between about 1 mm and about 10 mm from the susceptor support ring.

    Semiconductor deposition reactor ring

    公开(公告)号:USD1028913S1

    公开(公告)日:2024-05-28

    申请号:US29797476

    申请日:2021-06-30

    Abstract: FIG. 1 is a top perspective view of a semiconductor deposition reactor ring;
    FIG. 2 is a bottom perspective view thereof;
    FIG. 3 is a front view thereof;
    FIG. 4 is a back view thereof;
    FIG. 5 is a left view thereof;
    FIG. 6 is a right view thereof;
    FIG. 7 is a top view thereof; and,
    FIG. 8 is a bottom view thereof.
    The broken lines in the drawings illustrate portions of the semiconductor deposition reactor ring that form no part of the claimed design.

    SUBSTRATE HANDLING DEVICE WITH ADJUSTABLE JOINTS

    公开(公告)号:US20240096685A1

    公开(公告)日:2024-03-21

    申请号:US18509543

    申请日:2023-11-15

    CPC classification number: H01L21/68707 B65G47/90

    Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

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