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公开(公告)号：US20220415677A1
公开(公告)日：2022-12-29
申请号：US17848933
申请日：2022-06-24
申请人： ASM IP Holding B.V.
摘要： A reflector includes a reflector body arranged to overlap a reaction chamber of a semiconductor processing system. The reflector body has a grooved surface and a reflective surface extending between a first longitudinal edge of the reflector body and a second longitudinal edge of the reflector body, the reflective surface spaced apart from the grooved surface by a thickness of the reflector body. The grooved surface and the reflective surface define a pyrometer port, two or more elongated slots, and two or more shortened extending through the thickness of the reflector body. The shortened slots outnumber the elongated slots to bias issue of a coolant against the reaction chamber toward the second longitudinal edge of the reflector body. Cooling kits, semiconductor processing systems, and methods of cooling a reaction chamber during deposition of a film onto a substrate supported within the reaction chamber are also described.
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公开(公告)号：US20220352006A1
公开(公告)日：2022-11-03
申请号：US17730967
申请日：2022-04-27
申请人： ASM IP Holding B.V.
发明人： Shujin Huang , Junwei Su , Xing Lin , Alexandros Demos , Rutvij Naik , Wentao Wang , Matthew Goodman , Robin Scott , Amir Kajbafvala , Robinson James , Youness Alvandi-Tabrizi , Caleb Miskin
IPC分类号： H01L21/687 , C23C16/52 , C23C16/458
摘要： A susceptor has a circular pocket portion, an annular ledge portion, and an annular rim ledge portion. The circular pocket portion is arranged along a rotation axis and has a perforated surface. The annular ledge portion extends circumferentially about pocket portion and has ledge surface that slopes axially upward from the perforated surface. The rim portion extends circumferentially about the ledge portion and is connected to the pocket portion by the ledge portion of the susceptor. The susceptor has one or more of a tuned pocket, a contact break, a precursor vent, and a purge channel located radially outward of the perforated surface to control deposition of a film onto a substrate supported by the susceptor. Semiconductor processing systems, film deposition methods, and methods of making susceptors are also described.
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公开(公告)号：US20230034114A1
公开(公告)日：2023-02-02
申请号：US17961882
申请日：2022-10-07
申请人： ASM IP Holding B.V.
发明人： KiHyun Kim , Sam Kim , Rutvij Naik
IPC分类号： H01L21/687 , B65G47/90
摘要： An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
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公开(公告)号：US20220301906A1
公开(公告)日：2022-09-22
申请号：US17697164
申请日：2022-03-17
申请人： ASM IP Holding B.V.
发明人： Rutvij Naik , Shujin Huang , Junwei Su , Xing Lin
摘要： A reactor system designed to provide accurate monitoring of wafer temperatures during deposition steps. The reactor system includes a pyrometer mounting assembly supporting and positioning three or more pyrometers (e.g., infrared (IR) pyrometers) relative to the reaction chamber to measure a center wafer temperature and an edge wafer temperature as well as reaction chamber temperature. The pyrometer mounting assembly provides a small spot size or temperature sensing area with the edge pyrometer to accurately measure edge wafer temperatures. A jig assembly, and installation method for each tool setup, is provided for use in achieving accurate alignment of the IR pyrometer sensing spot (and the edge pyrometer) relative to the wafer, when the pyrometer mounting assembly is mounted upon a lamp bank in the reactor system or in tool setup. The wafer edge temperature sensing with the reactor system assembled with proper alignment ensures accurate and repeatable measurement of wafer temperatures.
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公开(公告)号：US20230002895A1
公开(公告)日：2023-01-05
申请号：US17810094
申请日：2022-06-30
申请人： ASM IP HOLDING B.V.
发明人： Rutvij Naik , Junwei Su , Wentao Wang , Chuqin Zhou , Xing Lin
IPC分类号： C23C16/458 , C23C16/455
摘要： Systems of reducing devitrification within a chemical vapor deposition system can include a susceptor support ring that is configured to be positioned between a gas inlet and a gas outlet of a chamber passage. An example system can also include a getter support comprising a support base and one or more recesses therein. Each of the one or more recesses can be arranged to receive corresponding one or more support elements that are configured to support the getter plate. At least a portion of the getter support may include a coating comprising silicon carbide (SiC) having a thickness of at least about 50 microns. The getter support may be arranged to be disposed a maximum distance of between about 1 mm and about 10 mm from the susceptor support ring.
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公开(公告)号：US11488854B2
公开(公告)日：2022-11-01
申请号：US17189787
申请日：2021-03-02
申请人： ASM IP Holding B.V.
发明人： KiHyun Kim , Sam Kim , Rutvij Naik
IPC分类号： H01L21/677 , H01L21/68 , H01L21/687 , B65G47/90
摘要： An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
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公开(公告)号：US20220298672A1
公开(公告)日：2022-09-22
申请号：US17697107
申请日：2022-03-17
申请人： ASM IP Holding B.V.
发明人： Hichem M'Saad , Alexandros Demos , Xing Lin , Junwei Su , Matthew Goodman , Daw Gen Lim , Shujin Huang , Rutvij Naik
IPC分类号： C30B25/16 , H01L21/66 , C30B25/10 , C30B25/12 , C30B23/06 , C23C16/52 , C23C16/46 , C23C14/54 , F27B17/00 , H05B3/00 , H05B1/02 , G01J5/00
摘要： A method of operating a reactor system to provide wafer temperature gradient control is provided. The method includes operating a center temperature sensor, a middle temperature sensor, and an edge temperature sensor to sense a temperature of a center zone of a wafer on a susceptor in reaction chamber of the reactor system, to sense a temperature of a middle zone of the wafer, and to sense a temperature of an edge zone of the wafer. The temperatures of the center, middle, and edge zones of the wafer are processed with a controller to generate control signals based on a predefined temperature gradient for the wafer. First, second, and third sets of heater lamps are operated based on the temperature of the center, middle, and edge zones to heat the center, the middle, and the edge zone of the wafer. Reactor systems are also described.
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公开(公告)号：US20210287928A1
公开(公告)日：2021-09-16
申请号：US17189787
申请日：2021-03-02
申请人： ASM IP Holding B.V.
发明人： KiHyun Kim , Sam Kim , Rutvij Naik
IPC分类号： H01L21/687 , B65G47/90
摘要： The present disclosure is directed to an adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
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